On the nature of the interface between Ag 3Sn intermetallics and Sn in Sn-3.5Ag solder alloys

Rajen S. Sidhu, Shantanu V. Madge, Xin Deng, Nikhilesh Chawla

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

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Engineering & Materials Science

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Chemical Compounds