On the nature of the interface between Ag 3Sn intermetallics and Sn in Sn-3.5Ag solder alloys

Rajen S. Sidhu; Shantanu V. Madge; Xin Deng; Nikhilesh Chawla

doi:10.1007/s11664-007-0239-9

On the nature of the interface between Ag ₃Sn intermetallics and Sn in Sn-3.5Ag solder alloys

Rajen S. Sidhu, Shantanu V. Madge, Xin Deng, Nikhilesh Chawla

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

Abstract

We report on the nature of the orientation of Ag ₃Sn and the Ag ₃Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag ₃Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag ₃Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag ₃Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.

Original language	English (US)
Pages (from-to)	1615-1620
Number of pages	6
Journal	Journal of Electronic Materials
Volume	36
Issue number	12
DOIs	https://doi.org/10.1007/s11664-007-0239-9
State	Published - Dec 2007

Keywords

Ag Sn
Orientation image microscopy
Pb-free solder
Sn-rich solder
Transmission electron microscopy

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1007/s11664-007-0239-9

Cite this

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title = "On the nature of the interface between Ag 3Sn intermetallics and Sn in Sn-3.5Ag solder alloys",

abstract = "We report on the nature of the orientation of Ag 3Sn and the Ag 3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag 3Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag 3Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag 3Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.",

keywords = "Ag Sn, Orientation image microscopy, Pb-free solder, Sn-rich solder, Transmission electron microscopy",

author = "Sidhu, {Rajen S.} and Madge, {Shantanu V.} and Xin Deng and Nikhilesh Chawla",

note = "Funding Information: The authors gratefully acknowledge financial support for support of this research from the National Science Foundation under Contract #DMR-0092530 (Drs. H. Chopra, S. Ankem, B. MacDonald, and K.L. Murty, Program Managers).",

year = "2007",

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T1 - On the nature of the interface between Ag 3Sn intermetallics and Sn in Sn-3.5Ag solder alloys

AU - Sidhu, Rajen S.

AU - Madge, Shantanu V.

AU - Deng, Xin

AU - Chawla, Nikhilesh

N1 - Funding Information: The authors gratefully acknowledge financial support for support of this research from the National Science Foundation under Contract #DMR-0092530 (Drs. H. Chopra, S. Ankem, B. MacDonald, and K.L. Murty, Program Managers).

PY - 2007/12

Y1 - 2007/12

N2 - We report on the nature of the orientation of Ag 3Sn and the Ag 3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag 3Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag 3Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag 3Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.

AB - We report on the nature of the orientation of Ag 3Sn and the Ag 3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag 3Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag 3Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag 3Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.

KW - Ag Sn

KW - Orientation image microscopy

KW - Pb-free solder

KW - Sn-rich solder

KW - Transmission electron microscopy

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