On the nature of the interface between Ag 3Sn intermetallics and Sn in Sn-3.5Ag solder alloys

Rajen S. Sidhu, Shantanu V. Madge, Xin Deng, Nikhilesh Chawla

Research output: Contribution to journalArticle

25 Scopus citations

Abstract

We report on the nature of the orientation of Ag 3Sn and the Ag 3Sn/Sn interface in Sn-3.5Ag solder. Orientation imaging microscopy (OIM) and transmission electron microscopy (TEM) were used to characterize the orientation and nature of the interface, respectively. OIM and TEM showed that Sn-3.5Ag containing spherical Ag 3Sn particles does not have a preferred orientation with respect to the Sn matrix. However, needle-like Ag 3Sn formed during slower cooling appeared to have a preferred orientation within individual Sn colonies. The interface between Sn and Ag 3Sn appeared to be incoherent, as confirmed by high-resolution TEM analysis.

Original languageEnglish (US)
Pages (from-to)1615-1620
Number of pages6
JournalJournal of Electronic Materials
Volume36
Issue number12
DOIs
StatePublished - Dec 1 2007

Keywords

  • Ag Sn
  • Orientation image microscopy
  • Pb-free solder
  • Sn-rich solder
  • Transmission electron microscopy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'On the nature of the interface between Ag <sub>3</sub>Sn intermetallics and Sn in Sn-3.5Ag solder alloys'. Together they form a unique fingerprint.

  • Cite this