On simplified fast modal analysis for through silicon vias in layered media based upon full-wave solutions

Zhonghai Guo, George Pan

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

Based on equivalent magnetic frill array model and Galerkin's procedure, we present a simplified full-wave algorithm to characterize the propagation behavior and signal integrity of massive number of through silicon vias (TSV) for the 3-D system-in-package (SIP) and system-on-chip (SOC) applications. The proposed method employs the Fourier transform and takes advantage of circular cylindrical shapes with Bessel's functions and the addition theorem to solve the Helmholtz equations without resorting numerical discretization. As a result, it provides closed form solutions with high precision. Since the algorithm does not rely on numerically generated meshes, it gains one to two orders of magnitude in speed, compared to popular commercial software packages. Numerical examples demonstrate that the new method provides good agreement with the HFSS results. As the number of vias increases the new method gains more in both speed and accuracy.

Original languageEnglish (US)
Article number5337992
Pages (from-to)517-523
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Volume33
Issue number2
DOIs
StatePublished - May 2010

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Modal analysis
Silicon
Bessel functions
Helmholtz equation
Software packages
Fourier transforms
System-in-package
System-on-chip

Keywords

  • Addition theorem
  • Bessel's functions
  • Printed circuit board
  • Signal integrity
  • Through silicon via
  • Wave equation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

On simplified fast modal analysis for through silicon vias in layered media based upon full-wave solutions. / Guo, Zhonghai; Pan, George.

In: IEEE Transactions on Advanced Packaging, Vol. 33, No. 2, 5337992, 05.2010, p. 517-523.

Research output: Contribution to journalArticle

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