On-chip interconnect modeling technologies

E. Aykut Dengi, Ronald A. Rohrer

Research output: Contribution to conferencePaper

1 Scopus citations

Abstract

On-chip interconnect must be accounted for at all levels of the design hierarchy, starting with synthesis, through physical design and ending with verification. Developing a compact model for an interconnect is important to render consistent interconnect models at different levels of the design hierarchy and achieve design convergence. This development requires on-chip modeling technologies for post-layout verification, called `parasitic extraction', and characterization/silicon-correlation which is important to interconnect modeling at all levels.

Original languageEnglish (US)
Number of pages1
StatePublished - Dec 1 1997
EventProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging - San Jose, CA, USA
Duration: Oct 27 1997Oct 29 1997

Other

OtherProceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging
CitySan Jose, CA, USA
Period10/27/9710/29/97

ASJC Scopus subject areas

  • Engineering(all)

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    Dengi, E. A., & Rohrer, R. A. (1997). On-chip interconnect modeling technologies. Paper presented at Proceedings of the 1997 6th Topical Meeting on Electrical Performance of Electronic Packaging, San Jose, CA, USA, .