On aperture coupling based compact system of lens enhanced phased array

Lisha Zhang, Abbas Abbaspour-Tamijani, George Pan, Helen K. Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We present design and implementation of the aperture coupling based compact system of lens enhanced phased array (LEPA) for 60 GHz band high-speed internet, data and voice channels. The LEPA is a high-directivity steerable integrated system without putting penalties on the chip size and DC power consumption. The core of a LEPA is composed of the antenna-filter-antenna (AFA) structures consisting of two layers of 15 mil-thick low-loss microwave laminates and three 18um-thick copper layers. An incident wave with proper polarization is received by the top slot in the input side, passes through a half-wave stripline resonator, and then reradiates from the bottom slot on the output side with orthogonal polarization. Vias surrounding AFA elements guarantee that no parallel plate modes are excited between the two grounds, while any surface wave modes formed on the reactive surface of the array may still contribute to the occurrence of blind scan angles and need to be suppressed.

Original languageEnglish (US)
Title of host publication2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages292-295
Number of pages4
DOIs
StatePublished - Dec 1 2012
Event2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 - Tempe, AZ, United States
Duration: Oct 21 2012Oct 24 2012

Publication series

Name2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

Other

Other2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Country/TerritoryUnited States
CityTempe, AZ
Period10/21/1210/24/12

Keywords

  • aperture coupling
  • directivity
  • laminates
  • lens
  • microwave
  • phased array

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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