On analytic model of multiple vias for high-speed printed circuit board and electric band-gap structures

Lisha Zhang, George Pan, Zhonghai Guo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We developed a full-wave formulation to model massive number of vias in high-speed printed circuit board (PCB), through silicon via (TSV) and electric band-gap (EBG) structures. This analytic method employs the equivalent magnetic frill array, Galerkin's procedure, image theory and Fourier transform to simplify the problem from a 3D configuration into a 2D frame. Based on Bessel's functions and addition theorem, the final matrix equation is formulated analytically without using any numerical techniques. The new method is purely from the boundary conditions. Consequently, it is simple, versatile, efficient and accurate. Numerical examples demonstrate good agreement between our analytical solution and commercial software (HFSS) for through silicon and PCB vias. The model is also used to study the EBG wall and cavity, for leakage fields.

Original languageEnglish (US)
Title of host publication2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages311-314
Number of pages4
DOIs
StatePublished - Dec 1 2012
Event2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 - Tempe, AZ, United States
Duration: Oct 21 2012Oct 24 2012

Publication series

Name2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012

Other

Other2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
CountryUnited States
CityTempe, AZ
Period10/21/1210/24/12

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Zhang, L., Pan, G., & Guo, Z. (2012). On analytic model of multiple vias for high-speed printed circuit board and electric band-gap structures. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 (pp. 311-314). [6457904] (2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012). https://doi.org/10.1109/EPEPS.2012.6457904