TY - GEN
T1 - Numerical simulation of the conjugate direct cooling of a micro heat generating element
AU - Nagasaki, T.
AU - Hijikata, K.
AU - Fushinobu, K.
AU - Phelan, P. E.
PY - 1992/12/1
Y1 - 1992/12/1
N2 - The heat transfer from a small heating element on a substrate has been investigated numerically. The heating element is positioned at the center of the substrate, and the upper surface of the substrate is cooled by forced convection of the cooling fluid. The computation is performed by using a domain decomposition technique, in which the calculation domain is divided into several zones. It is shown that the temperature of the heating element is mainly controlled by the heat conduction in the substrate near the heating element. On the other hand, the heat transfer to the cooling fluid requires much broader area of the substrate than the size of the heating element. The heat transfer from the substrate to the fluid agrees with the conventional forced-convection correlation of the forced convective heat transfer, but the local conduction-dominated cooling, which determines the peak temperature rise in the system, is relatively unaffected by the flow of the coolant.
AB - The heat transfer from a small heating element on a substrate has been investigated numerically. The heating element is positioned at the center of the substrate, and the upper surface of the substrate is cooled by forced convection of the cooling fluid. The computation is performed by using a domain decomposition technique, in which the calculation domain is divided into several zones. It is shown that the temperature of the heating element is mainly controlled by the heat conduction in the substrate near the heating element. On the other hand, the heat transfer to the cooling fluid requires much broader area of the substrate than the size of the heating element. The heat transfer from the substrate to the fluid agrees with the conventional forced-convection correlation of the forced convective heat transfer, but the local conduction-dominated cooling, which determines the peak temperature rise in the system, is relatively unaffected by the flow of the coolant.
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M3 - Conference contribution
AN - SCOPUS:0027044512
SN - 0791807665
T3 - American Society of Mechanical Engineers, EEP
SP - 217
EP - 223
BT - American Society of Mechanical Engineers, EEP
PB - Publ by ASME
T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
Y2 - 9 April 1992 through 12 April 1992
ER -