Original languageEnglish (US)
Title of host publicationIMAPS 12th International Conference and Exhibition on Device Packaging
PublisherIMAPS-International Microelectronics and Packaging Society
StatePublished - 2016
EventIMAPS 12th International Conference and Exhibition on Device Packaging - Fountain Hills, United States
Duration: Mar 14 2016Mar 17 2016

Other

OtherIMAPS 12th International Conference and Exhibition on Device Packaging
CountryUnited States
CityFountain Hills
Period3/14/163/17/16

Fingerprint

Solar cells
Copper
Computer simulation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Guo, D., Brinkman, D., Akis, R., Krasikov, D., Sankin, I., Vasileska, D., & Ringhofer, C. (2016). Numerical simulation of copper migration in CdTe solar cells. In IMAPS 12th International Conference and Exhibition on Device Packaging IMAPS-International Microelectronics and Packaging Society.

Numerical simulation of copper migration in CdTe solar cells. / Guo, Da; Brinkman, Daniel; Akis, Richard; Krasikov, Dmitry; Sankin, Igor; Vasileska, Dragica; Ringhofer, Christian.

IMAPS 12th International Conference and Exhibition on Device Packaging. IMAPS-International Microelectronics and Packaging Society, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Guo, D, Brinkman, D, Akis, R, Krasikov, D, Sankin, I, Vasileska, D & Ringhofer, C 2016, Numerical simulation of copper migration in CdTe solar cells. in IMAPS 12th International Conference and Exhibition on Device Packaging. IMAPS-International Microelectronics and Packaging Society, IMAPS 12th International Conference and Exhibition on Device Packaging, Fountain Hills, United States, 3/14/16.
Guo D, Brinkman D, Akis R, Krasikov D, Sankin I, Vasileska D et al. Numerical simulation of copper migration in CdTe solar cells. In IMAPS 12th International Conference and Exhibition on Device Packaging. IMAPS-International Microelectronics and Packaging Society. 2016
Guo, Da ; Brinkman, Daniel ; Akis, Richard ; Krasikov, Dmitry ; Sankin, Igor ; Vasileska, Dragica ; Ringhofer, Christian. / Numerical simulation of copper migration in CdTe solar cells. IMAPS 12th International Conference and Exhibition on Device Packaging. IMAPS-International Microelectronics and Packaging Society, 2016.
@inproceedings{1dbb39d8bbc6492ea282a6c09e4746bf,
title = "Numerical simulation of copper migration in CdTe solar cells",
author = "Da Guo and Daniel Brinkman and Richard Akis and Dmitry Krasikov and Igor Sankin and Dragica Vasileska and Christian Ringhofer",
year = "2016",
language = "English (US)",
booktitle = "IMAPS 12th International Conference and Exhibition on Device Packaging",
publisher = "IMAPS-International Microelectronics and Packaging Society",
address = "United States",

}

TY - GEN

T1 - Numerical simulation of copper migration in CdTe solar cells

AU - Guo, Da

AU - Brinkman, Daniel

AU - Akis, Richard

AU - Krasikov, Dmitry

AU - Sankin, Igor

AU - Vasileska, Dragica

AU - Ringhofer, Christian

PY - 2016

Y1 - 2016

UR - http://www.scopus.com/inward/record.url?scp=84995608805&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84995608805&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84995608805

BT - IMAPS 12th International Conference and Exhibition on Device Packaging

PB - IMAPS-International Microelectronics and Packaging Society

ER -