Nucleation and growth of voids in shock loaded copper bicrystals

Elizabeth Fortin, Benjamin Shaffer, Saul Opie, Pedro Peralta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Understanding the evolution of damage and deformation due to spall at grain boundaries can provide a basis for connecting micro- to macroscale failure behavior in metals under extreme conditions. Copper bicrystal samples were shock loaded using flyer-plate impacts in a light gas gun with shock stresses ranging from 3 to 6 GPa. Pulse duration as well as crystal orientation along the shock direction were varied for a fixed boundary misorientation to determine their effects on void nucleation and coalescence. Samples were soft recovered and cross-sectioned to characterize damage using electron backscattering diffraction and scanning electron microscopy to gather information on damage characteristics at and around the GB, with emphasis on growth of boundary and bulk voids. Chemistry and composition analysis were also performed on samples to determine if trace elements present in a sample affected the threshold for void nucleation. Results show that the kinetics of damage growth at the boundary are strongly affected by stress level and impurities. It was found that the boundary selected had a similar or even lower tendency to show damage than the bulk at low pulse durations and amplitudes. As pulse duration and amplitude increased damage localized at the boundary, which was found to consist of many small voids, indicating that the boundary experienced rapid void nucleation and coalescence. The presence of impurities correlated strongly with scatter on damage evolution.

Original languageEnglish (US)
Title of host publicationShock Compression of Condensed Matter - 2019
Subtitle of host publicationProceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
EditorsJ. Matthew D. Lane, Timothy C. Germann, Michael R. Armstrong, Ryan Wixom, David Damm, Joseph Zaug
PublisherAmerican Institute of Physics Inc.
ISBN (Electronic)9780735440005
DOIs
StatePublished - Nov 2 2020
Event21st Biennial American Physical Society Conference on Shock Compression of Condensed Matter, SCCM 2019 - Portland, United States
Duration: Jun 16 2019Jun 21 2019

Publication series

NameAIP Conference Proceedings
Volume2272
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference21st Biennial American Physical Society Conference on Shock Compression of Condensed Matter, SCCM 2019
Country/TerritoryUnited States
CityPortland
Period6/16/196/21/19

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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