Novel technique to pattern silver using CF4 and CF4/O2 glow discharges

Phucanh Nguyen, Yuxiao Zeng, Terry Alford

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

A novel technique to pattern Ag thin films using CF4 and CF4/O2 glow discharges at low temperatures followed by a resist strip process is proposed. Ag reacts with the reactive species from glow discharge to form byproducts which are simultaneously sputtered and desorped during plasma exposure. The reacted Ag films are dissolved in a warm microstrip solvent for film removal. The effects of process conditions on etch rate and post-etch surface roughness are studied.

Original languageEnglish (US)
Pages (from-to)158-165
Number of pages8
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume19
Issue number1
DOIs
StatePublished - Jan 2001

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Glow discharges
Silver
Byproducts
Surface roughness
Plasmas
Thin films
Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Novel technique to pattern silver using CF4 and CF4/O2 glow discharges. / Nguyen, Phucanh; Zeng, Yuxiao; Alford, Terry.

In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 19, No. 1, 01.2001, p. 158-165.

Research output: Contribution to journalArticle

@article{b7af6a4669ac42bfbf6e83016490f229,
title = "Novel technique to pattern silver using CF4 and CF4/O2 glow discharges",
abstract = "A novel technique to pattern Ag thin films using CF4 and CF4/O2 glow discharges at low temperatures followed by a resist strip process is proposed. Ag reacts with the reactive species from glow discharge to form byproducts which are simultaneously sputtered and desorped during plasma exposure. The reacted Ag films are dissolved in a warm microstrip solvent for film removal. The effects of process conditions on etch rate and post-etch surface roughness are studied.",
author = "Phucanh Nguyen and Yuxiao Zeng and Terry Alford",
year = "2001",
month = "1",
doi = "10.1116/1.1333080",
language = "English (US)",
volume = "19",
pages = "158--165",
journal = "Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena",
issn = "1071-1023",
publisher = "AVS Science and Technology Society",
number = "1",

}

TY - JOUR

T1 - Novel technique to pattern silver using CF4 and CF4/O2 glow discharges

AU - Nguyen, Phucanh

AU - Zeng, Yuxiao

AU - Alford, Terry

PY - 2001/1

Y1 - 2001/1

N2 - A novel technique to pattern Ag thin films using CF4 and CF4/O2 glow discharges at low temperatures followed by a resist strip process is proposed. Ag reacts with the reactive species from glow discharge to form byproducts which are simultaneously sputtered and desorped during plasma exposure. The reacted Ag films are dissolved in a warm microstrip solvent for film removal. The effects of process conditions on etch rate and post-etch surface roughness are studied.

AB - A novel technique to pattern Ag thin films using CF4 and CF4/O2 glow discharges at low temperatures followed by a resist strip process is proposed. Ag reacts with the reactive species from glow discharge to form byproducts which are simultaneously sputtered and desorped during plasma exposure. The reacted Ag films are dissolved in a warm microstrip solvent for film removal. The effects of process conditions on etch rate and post-etch surface roughness are studied.

UR - http://www.scopus.com/inward/record.url?scp=0035078373&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035078373&partnerID=8YFLogxK

U2 - 10.1116/1.1333080

DO - 10.1116/1.1333080

M3 - Article

VL - 19

SP - 158

EP - 165

JO - Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena

JF - Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena

SN - 1071-1023

IS - 1

ER -