Novel technique to pattern silver using CF4 and CF4/O2 glow discharges

Phucanh Nguyen, Yuxiao Zeng, Terry Alford

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

A novel technique to pattern Ag thin films using CF4 and CF4/O2 glow discharges at low temperatures followed by a resist strip process is proposed. Ag reacts with the reactive species from glow discharge to form byproducts which are simultaneously sputtered and desorped during plasma exposure. The reacted Ag films are dissolved in a warm microstrip solvent for film removal. The effects of process conditions on etch rate and post-etch surface roughness are studied.

Original languageEnglish (US)
Pages (from-to)158-165
Number of pages8
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume19
Issue number1
DOIs
StatePublished - Jan 1 2001

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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