Abstract
Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations oftin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements have been shown to refine the microstructure of several lead-free solder systems, thus improving their mechanical properties. This study investigated the effect of the addition of lanthanum on the melting behavior, microstructure, and shear strength of an Sn-3.9Ag-0.7Cu alloy. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed.
Original language | English (US) |
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Pages (from-to) | 57-62 |
Number of pages | 6 |
Journal | JOM |
Volume | 58 |
Issue number | 6 |
DOIs | |
State | Published - Jun 2006 |
ASJC Scopus subject areas
- General Materials Science
- General Engineering