Novel rare-earth-containing lead-free solders with enhanced ductility

M. A. Dudek, R. S. Sidhu, Nikhilesh Chawla

Research output: Contribution to journalArticle

51 Citations (Scopus)

Abstract

Several lead-free material systems are available as replacements for traditional lead-based solders in microelectronic packaging, including near-eutectic combinations oftin-rich alloys. Although these materials have superior mechanical properties as compared to the Pb-Sn system, much work remains in developing these materials for electronic packaging. Small additions of rare-earth elements have been shown to refine the microstructure of several lead-free solder systems, thus improving their mechanical properties. This study investigated the effect of the addition of lanthanum on the melting behavior, microstructure, and shear strength of an Sn-3.9Ag-0.7Cu alloy. The influence of LaSn3 intermetallics on microstructural refinement and damage evolution in these novel solders is discussed.

Original languageEnglish (US)
Pages (from-to)57-62
Number of pages6
JournalJOM
Volume58
Issue number6
StatePublished - Jun 2006

Fingerprint

ductility
Rare earths
Ductility
Soldering alloys
mechanical property
microstructure
Lead
Lanthanum
Mechanical properties
Microstructure
Electronics packaging
Rare earth elements
Microelectronics
Shear strength
Eutectics
shear strength
Intermetallics
Packaging
Melting
rare earth element

ASJC Scopus subject areas

  • Geochemistry and Petrology
  • Geotechnical Engineering and Engineering Geology
  • Materials Science(all)
  • Metals and Alloys

Cite this

Novel rare-earth-containing lead-free solders with enhanced ductility. / Dudek, M. A.; Sidhu, R. S.; Chawla, Nikhilesh.

In: JOM, Vol. 58, No. 6, 06.2006, p. 57-62.

Research output: Contribution to journalArticle

Dudek, MA, Sidhu, RS & Chawla, N 2006, 'Novel rare-earth-containing lead-free solders with enhanced ductility', JOM, vol. 58, no. 6, pp. 57-62.
Dudek, M. A. ; Sidhu, R. S. ; Chawla, Nikhilesh. / Novel rare-earth-containing lead-free solders with enhanced ductility. In: JOM. 2006 ; Vol. 58, No. 6. pp. 57-62.
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