Novel method to extract arrays of aligned carbon nanotube bundles from CNT film using solder ball grid arrays for higher performance device interconnects

Owen Hildreth, Wei Lin, Carlos Alvarez, C. P. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Carbon nanotubes (CNTs) are an attractive electrical interconnect material due to their excellent mechanical,electrical and thermal properties. Despite these advantagesCNTs have not been widely adopted by industry primarily because of the difficulties associated with integrating CNTs into device electronics. In this paper we demonstrate that bundles of aligned CNTs can be extracted directly from a CNT film using solder ball grid arrays (BGA). The resulting CNT bundles adhere directly to the solder balls and show good vertical alignment. The affect of flux, CNT application displacement and solder ball phase (liquid or solid) on CNT bundle alignment and coverage area were examined. This simple process could be used to mechanically decouple the BGA from the substrate, reducing solder ball fatigue due tothermal cycling and increasing device reliability

Original languageEnglish (US)
Title of host publication2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages1460-1464
Number of pages5
DOIs
StatePublished - Oct 12 2009
Event2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
Duration: May 26 2009May 29 2009

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2009 59th Electronic Components and Technology Conference, ECTC 2009
CountryUnited States
CitySan Diego, CA
Period5/26/095/29/09

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Hildreth, O., Lin, W., Alvarez, C., & Wong, C. P. (2009). Novel method to extract arrays of aligned carbon nanotube bundles from CNT film using solder ball grid arrays for higher performance device interconnects. In 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 1460-1464). [5074204] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074204