Novel Foil Interconnects for Back-Contact Silicon Solar Cells

Kathryn Fisher, Xiaodong Meng, Barry Hartweg, Sujyot Mony, Mariana Bertoni, Zachary Holman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

Large area back-contact solar cells enable module costs almost as low as those of PERCs but with higher efficiency. Traditional tabbing and stringing interconnects are problematic for back-contact cells, however, as placing all the tabs on one side of the wafer causes bowing due to CTE mismatch. Back-contact cells can be effectively encapsulated using Cu conductive back-sheets (CBS) with electrically conductive adhesive (ECA) interconnects but the cost is higher than for ribbon tabbing. In this paper we present a method for replacing the Cu CBS with a cheaper Al version and the ECA with several cheaper and potentially more robust methods for connecting the foil to the cell.

Original languageEnglish (US)
Title of host publication2019 IEEE 46th Photovoltaic Specialists Conference, PVSC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages126-130
Number of pages5
ISBN (Electronic)9781728104942
DOIs
StatePublished - Jun 2019
Event46th IEEE Photovoltaic Specialists Conference, PVSC 2019 - Chicago, United States
Duration: Jun 16 2019Jun 21 2019

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371

Conference

Conference46th IEEE Photovoltaic Specialists Conference, PVSC 2019
Country/TerritoryUnited States
CityChicago
Period6/16/196/21/19

Keywords

  • Back-contact modules
  • aluminum interconnects
  • conductive adhesives
  • conductive back-sheets
  • laser welding
  • reliability

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Novel Foil Interconnects for Back-Contact Silicon Solar Cells'. Together they form a unique fingerprint.

Cite this