Novel first-level interconnect techniques for flip chip on MEMS devices

Jemmy Sutanto, Sindhu Anand, Chetan Patel, Jitendran Muthuswamy

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

Flip-chip packaging is desirable for microelectromechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTV \rm TM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm 2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking.

Original languageEnglish (US)
Article number6069517
Pages (from-to)132-144
Number of pages13
JournalJournal of Microelectromechanical Systems
Volume21
Issue number1
DOIs
StatePublished - Feb 2012

Fingerprint

MEMS
Soldering alloys
Aspect ratio
Packaging
Microelectrodes
Microfabrication
Degassing
Shear strength
Contamination

Keywords

  • 3-D stacks
  • BioMEMS
  • flip chip
  • flux contamination
  • interconnects
  • microchip
  • packaging
  • solder

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Novel first-level interconnect techniques for flip chip on MEMS devices. / Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jitendran.

In: Journal of Microelectromechanical Systems, Vol. 21, No. 1, 6069517, 02.2012, p. 132-144.

Research output: Contribution to journalArticle

Sutanto, Jemmy ; Anand, Sindhu ; Patel, Chetan ; Muthuswamy, Jitendran. / Novel first-level interconnect techniques for flip chip on MEMS devices. In: Journal of Microelectromechanical Systems. 2012 ; Vol. 21, No. 1. pp. 132-144.
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