Abstract
The existence of non-wet solder joints in PCB sockets can cause boards failures and it's necessary to inspect theses sockets to locate any possible defective joints. 2D or advanced x-ray machines are used to image solder joints in processor sockets and make solder joints visible to be examined by the operator who determines if each individual joint is defective or not. This is a very time consuming process since each processor has an average of 150 images with 30 joints per image. An accurate and efficient non-wet detection method is proposed in this paper. The main components of the proposed method consist of region of interest (ROI) segmentation, feature extraction, reference-free classification, and automatic mapping. The ROI segmentation process is a noise-resilient segmentation method for the joint area. The centroids of the segmented joints (ROIs) are used as feature parameters to detect the suspect joints. The proposed reference-free classification can detect defective joints with high accuracy without the need for training data. An automatic mapping method is used to get the precise label and location of the suspect joint. The accuracy of the proposed method was determined to be 95.8% detection rate with 1.1% false alarm rate based on the examination of 56 sockets (500K joints). In comparison, the detection rates of currently available advanced x-ray tools with multi-dimension capability are in the range of 43% to 75%. The proposed method reduces the operator effort by 90%. The presented system identifies neighboring joints to any missed non-wet joints, which provides an operator with the capability to make 100% detection of all non-wets. The proposed scheme works with a 2D x-ray imaging device, which makes the proposed scheme relatively inexpensive to implement, and is very portable and easy to set up as compared to the available advanced x-ray tools with multi-dimension capability.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings - Electronic Components and Technology Conference |
| Pages | 1147-1153 |
| Number of pages | 7 |
| DOIs | |
| State | Published - 2010 |
| Event | 60th Electronic Components and Technology Conference, ECTC 2010 - Las Vegas, NV, United States Duration: Jun 1 2010 → Jun 4 2010 |
Other
| Other | 60th Electronic Components and Technology Conference, ECTC 2010 |
|---|---|
| Country | United States |
| City | Las Vegas, NV |
| Period | 6/1/10 → 6/4/10 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
Cite this
Non-wet solder joint detection in processor sockets and BGA assemblies. / Said, Asaad F.; Bennett, Bonnie L.; Toth, Francis; Karam, Lina; Pettinato, Jeff.
Proceedings - Electronic Components and Technology Conference. 2010. p. 1147-1153 5490846.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Non-wet solder joint detection in processor sockets and BGA assemblies
AU - Said, Asaad F.
AU - Bennett, Bonnie L.
AU - Toth, Francis
AU - Karam, Lina
AU - Pettinato, Jeff
PY - 2010
Y1 - 2010
N2 - The existence of non-wet solder joints in PCB sockets can cause boards failures and it's necessary to inspect theses sockets to locate any possible defective joints. 2D or advanced x-ray machines are used to image solder joints in processor sockets and make solder joints visible to be examined by the operator who determines if each individual joint is defective or not. This is a very time consuming process since each processor has an average of 150 images with 30 joints per image. An accurate and efficient non-wet detection method is proposed in this paper. The main components of the proposed method consist of region of interest (ROI) segmentation, feature extraction, reference-free classification, and automatic mapping. The ROI segmentation process is a noise-resilient segmentation method for the joint area. The centroids of the segmented joints (ROIs) are used as feature parameters to detect the suspect joints. The proposed reference-free classification can detect defective joints with high accuracy without the need for training data. An automatic mapping method is used to get the precise label and location of the suspect joint. The accuracy of the proposed method was determined to be 95.8% detection rate with 1.1% false alarm rate based on the examination of 56 sockets (500K joints). In comparison, the detection rates of currently available advanced x-ray tools with multi-dimension capability are in the range of 43% to 75%. The proposed method reduces the operator effort by 90%. The presented system identifies neighboring joints to any missed non-wet joints, which provides an operator with the capability to make 100% detection of all non-wets. The proposed scheme works with a 2D x-ray imaging device, which makes the proposed scheme relatively inexpensive to implement, and is very portable and easy to set up as compared to the available advanced x-ray tools with multi-dimension capability.
AB - The existence of non-wet solder joints in PCB sockets can cause boards failures and it's necessary to inspect theses sockets to locate any possible defective joints. 2D or advanced x-ray machines are used to image solder joints in processor sockets and make solder joints visible to be examined by the operator who determines if each individual joint is defective or not. This is a very time consuming process since each processor has an average of 150 images with 30 joints per image. An accurate and efficient non-wet detection method is proposed in this paper. The main components of the proposed method consist of region of interest (ROI) segmentation, feature extraction, reference-free classification, and automatic mapping. The ROI segmentation process is a noise-resilient segmentation method for the joint area. The centroids of the segmented joints (ROIs) are used as feature parameters to detect the suspect joints. The proposed reference-free classification can detect defective joints with high accuracy without the need for training data. An automatic mapping method is used to get the precise label and location of the suspect joint. The accuracy of the proposed method was determined to be 95.8% detection rate with 1.1% false alarm rate based on the examination of 56 sockets (500K joints). In comparison, the detection rates of currently available advanced x-ray tools with multi-dimension capability are in the range of 43% to 75%. The proposed method reduces the operator effort by 90%. The presented system identifies neighboring joints to any missed non-wet joints, which provides an operator with the capability to make 100% detection of all non-wets. The proposed scheme works with a 2D x-ray imaging device, which makes the proposed scheme relatively inexpensive to implement, and is very portable and easy to set up as compared to the available advanced x-ray tools with multi-dimension capability.
UR - http://www.scopus.com/inward/record.url?scp=77955184055&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77955184055&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2010.5490846
DO - 10.1109/ECTC.2010.5490846
M3 - Conference contribution
SN - 9781424464104
SP - 1147
EP - 1153
BT - Proceedings - Electronic Components and Technology Conference
ER -