Non-empirical modeling of fatigue in lead-free solder joints

Fatigue failure analysis and estimation of fracture parameters

Dhruv Bhate, D. Chan, G. Subbarayan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. This study is divided into two parts: In the first part, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is discussed. The hybrid fatigue model has been shown to predict the crack trajectory and fatigue life of a Sn-Pb solder interconnection subjected to both isothermal accelerated thermal and anisothermal power cycling conditions. In the second part, results of experimental characterization via fatigue testing of microelectronic packages with SnAgCu solder interconnections subjected to anisothermal power cycling conditions are described. Packages of different geometries were tested to study the effects of these variations on the estimation of fatigue life. The afore mentioned hybrid model relies on the estimation of two fracture parameters which are to be determined experimentally. In this study, a novel technique involving tracking crack fronts in solder interconnections as a function of number of fatigue cycles is proposed to estimate these fracture parameters that can be then used to model fatigue crack growth using the hybrid modeling technique.

Original languageEnglish (US)
Title of host publication7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Volume2006
DOIs
StatePublished - Dec 1 2006
Externally publishedYes
Event7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 - Como, Italy
Duration: Apr 24 2006Apr 26 2006

Other

Other7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
CountryItaly
CityComo
Period4/24/064/26/06

Fingerprint

Failure analysis
Soldering alloys
Fatigue of materials
Cracks
Fatigue testing
Lead-free solders
Thermal cycling
Fatigue crack propagation
Fracture mechanics
Microelectronics
Creep
Trajectories
Geometry

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Bhate, D., Chan, D., & Subbarayan, G. (2006). Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters. In 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 (Vol. 2006). [1643992] https://doi.org/10.1109/ESIME.2006.1643992

Non-empirical modeling of fatigue in lead-free solder joints : Fatigue failure analysis and estimation of fracture parameters. / Bhate, Dhruv; Chan, D.; Subbarayan, G.

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006 2006. 1643992.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bhate, D, Chan, D & Subbarayan, G 2006, Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters. in 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. vol. 2006, 1643992, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006, Como, Italy, 4/24/06. https://doi.org/10.1109/ESIME.2006.1643992
Bhate D, Chan D, Subbarayan G. Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters. In 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006. 2006. 1643992 https://doi.org/10.1109/ESIME.2006.1643992
Bhate, Dhruv ; Chan, D. ; Subbarayan, G. / Non-empirical modeling of fatigue in lead-free solder joints : Fatigue failure analysis and estimation of fracture parameters. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006 2006.
@inproceedings{2ebacc6416164fc9921723d83b40c01b,
title = "Non-empirical modeling of fatigue in lead-free solder joints: Fatigue failure analysis and estimation of fracture parameters",
abstract = "Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. This study is divided into two parts: In the first part, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is discussed. The hybrid fatigue model has been shown to predict the crack trajectory and fatigue life of a Sn-Pb solder interconnection subjected to both isothermal accelerated thermal and anisothermal power cycling conditions. In the second part, results of experimental characterization via fatigue testing of microelectronic packages with SnAgCu solder interconnections subjected to anisothermal power cycling conditions are described. Packages of different geometries were tested to study the effects of these variations on the estimation of fatigue life. The afore mentioned hybrid model relies on the estimation of two fracture parameters which are to be determined experimentally. In this study, a novel technique involving tracking crack fronts in solder interconnections as a function of number of fatigue cycles is proposed to estimate these fracture parameters that can be then used to model fatigue crack growth using the hybrid modeling technique.",
author = "Dhruv Bhate and D. Chan and G. Subbarayan",
year = "2006",
month = "12",
day = "1",
doi = "10.1109/ESIME.2006.1643992",
language = "English (US)",
isbn = "1424402751",
volume = "2006",
booktitle = "7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006",

}

TY - GEN

T1 - Non-empirical modeling of fatigue in lead-free solder joints

T2 - Fatigue failure analysis and estimation of fracture parameters

AU - Bhate, Dhruv

AU - Chan, D.

AU - Subbarayan, G.

PY - 2006/12/1

Y1 - 2006/12/1

N2 - Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. This study is divided into two parts: In the first part, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is discussed. The hybrid fatigue model has been shown to predict the crack trajectory and fatigue life of a Sn-Pb solder interconnection subjected to both isothermal accelerated thermal and anisothermal power cycling conditions. In the second part, results of experimental characterization via fatigue testing of microelectronic packages with SnAgCu solder interconnections subjected to anisothermal power cycling conditions are described. Packages of different geometries were tested to study the effects of these variations on the estimation of fatigue life. The afore mentioned hybrid model relies on the estimation of two fracture parameters which are to be determined experimentally. In this study, a novel technique involving tracking crack fronts in solder interconnections as a function of number of fatigue cycles is proposed to estimate these fracture parameters that can be then used to model fatigue crack growth using the hybrid modeling technique.

AB - Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. This study is divided into two parts: In the first part, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is discussed. The hybrid fatigue model has been shown to predict the crack trajectory and fatigue life of a Sn-Pb solder interconnection subjected to both isothermal accelerated thermal and anisothermal power cycling conditions. In the second part, results of experimental characterization via fatigue testing of microelectronic packages with SnAgCu solder interconnections subjected to anisothermal power cycling conditions are described. Packages of different geometries were tested to study the effects of these variations on the estimation of fatigue life. The afore mentioned hybrid model relies on the estimation of two fracture parameters which are to be determined experimentally. In this study, a novel technique involving tracking crack fronts in solder interconnections as a function of number of fatigue cycles is proposed to estimate these fracture parameters that can be then used to model fatigue crack growth using the hybrid modeling technique.

UR - http://www.scopus.com/inward/record.url?scp=33847170616&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847170616&partnerID=8YFLogxK

U2 - 10.1109/ESIME.2006.1643992

DO - 10.1109/ESIME.2006.1643992

M3 - Conference contribution

SN - 1424402751

SN - 9781424402755

VL - 2006

BT - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

ER -