Non-contact THz probes for on-chip device and IC characterization

Georgios Trichopoulos, Kagan Topalli, Kubilay Sertel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1-3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.

Original languageEnglish (US)
Title of host publicationNational Aerospace and Electronics Conference, Proceedings of the IEEE
Pages34-35
Number of pages2
DOIs
StatePublished - 2013
Externally publishedYes
Event2012 IEEE National Aerospace and Electronics Conference, NAECON 2012 - Dayton, OH, United States
Duration: Jul 25 2012Jul 27 2012

Other

Other2012 IEEE National Aerospace and Electronics Conference, NAECON 2012
CountryUnited States
CityDayton, OH
Period7/25/127/27/12

Fingerprint

Antennas
Horn antennas
Electric network analyzers
Coplanar waveguides
Semiconductor devices
Integrated circuits
Lenses
Microwaves
Calibration

Keywords

  • mmW
  • sub-mmW
  • THz antennas
  • THz device characterization

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Aerospace Engineering

Cite this

Trichopoulos, G., Topalli, K., & Sertel, K. (2013). Non-contact THz probes for on-chip device and IC characterization. In National Aerospace and Electronics Conference, Proceedings of the IEEE (pp. 34-35). [6531023] https://doi.org/10.1109/NAECON.2012.6531023

Non-contact THz probes for on-chip device and IC characterization. / Trichopoulos, Georgios; Topalli, Kagan; Sertel, Kubilay.

National Aerospace and Electronics Conference, Proceedings of the IEEE. 2013. p. 34-35 6531023.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Trichopoulos, G, Topalli, K & Sertel, K 2013, Non-contact THz probes for on-chip device and IC characterization. in National Aerospace and Electronics Conference, Proceedings of the IEEE., 6531023, pp. 34-35, 2012 IEEE National Aerospace and Electronics Conference, NAECON 2012, Dayton, OH, United States, 7/25/12. https://doi.org/10.1109/NAECON.2012.6531023
Trichopoulos G, Topalli K, Sertel K. Non-contact THz probes for on-chip device and IC characterization. In National Aerospace and Electronics Conference, Proceedings of the IEEE. 2013. p. 34-35. 6531023 https://doi.org/10.1109/NAECON.2012.6531023
Trichopoulos, Georgios ; Topalli, Kagan ; Sertel, Kubilay. / Non-contact THz probes for on-chip device and IC characterization. National Aerospace and Electronics Conference, Proceedings of the IEEE. 2013. pp. 34-35
@inproceedings{3339ab8f83cc40b089990ad10fc53756,
title = "Non-contact THz probes for on-chip device and IC characterization",
abstract = "We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1-3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.",
keywords = "mmW, sub-mmW, THz antennas, THz device characterization",
author = "Georgios Trichopoulos and Kagan Topalli and Kubilay Sertel",
year = "2013",
doi = "10.1109/NAECON.2012.6531023",
language = "English (US)",
isbn = "9781467327916",
pages = "34--35",
booktitle = "National Aerospace and Electronics Conference, Proceedings of the IEEE",

}

TY - GEN

T1 - Non-contact THz probes for on-chip device and IC characterization

AU - Trichopoulos, Georgios

AU - Topalli, Kagan

AU - Sertel, Kubilay

PY - 2013

Y1 - 2013

N2 - We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1-3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.

AB - We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1-3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.

KW - mmW

KW - sub-mmW

KW - THz antennas

KW - THz device characterization

UR - http://www.scopus.com/inward/record.url?scp=84881038412&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84881038412&partnerID=8YFLogxK

U2 - 10.1109/NAECON.2012.6531023

DO - 10.1109/NAECON.2012.6531023

M3 - Conference contribution

SN - 9781467327916

SP - 34

EP - 35

BT - National Aerospace and Electronics Conference, Proceedings of the IEEE

ER -