Non-contact THz probes for on-chip device and IC characterization

Georgios C. Trichopoulos, Kagan Topalli, Kubilay Sertel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1-3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.

Original languageEnglish (US)
Title of host publicationProceedings of the 2012 IEEE National Aerospace and Electronics Conference, NAECON 2012
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages34-35
Number of pages2
ISBN (Print)9781467327916
DOIs
StatePublished - Jan 1 2012
Externally publishedYes
Event2012 IEEE National Aerospace and Electronics Conference, NAECON 2012 - Dayton, OH, United States
Duration: Jul 25 2012Jul 27 2012

Publication series

NameNational Aerospace and Electronics Conference, Proceedings of the IEEE

Other

Other2012 IEEE National Aerospace and Electronics Conference, NAECON 2012
Country/TerritoryUnited States
CityDayton, OH
Period7/25/127/27/12

Keywords

  • THz antennas
  • THz device characterization
  • mmW
  • sub-mmW

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Aerospace Engineering

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