TY - GEN
T1 - Non-contact probes for device and integrated circuit characterization in the THz and mmW bands
AU - Caglayan, Cosan
AU - Trichopoulos, Georgios C.
AU - Sertel, Kubilay
PY - 2014/1/1
Y1 - 2014/1/1
N2 - We present a novel, non-contact, on-wafer device characterization method covering both THz (300 GHz-3 THz) and mmW bands (60-300 GHz). Unlike existing contact probes which rely on fragile tips and physical contact with the device on the chip, the new non-contact probe setup is based on radiative coupling of vector network analyzer test ports into the coplanar waveguide environment of monolithic devices and integrated circuits via planar, on-chip, broadband antennas. The on-chip antennas act as 'virtual' probe-tips on the test wafer and connect to the device through optimized, impedance matched coplanar waveguide (CPW) lines. Proof-of-concept validation is presented for the 325-750 GHz band using WR2.2 and WR1.5 frequency extender modules and a standard vector network analyzer as the backend. Owing to the non-contact nature, these new probes are free from wear/tear and fragility issues. More importantly, they are low cost and can be easily scaled beyond 900GHz where there is no existing solution for on-wafer device and integrated circuit testing.
AB - We present a novel, non-contact, on-wafer device characterization method covering both THz (300 GHz-3 THz) and mmW bands (60-300 GHz). Unlike existing contact probes which rely on fragile tips and physical contact with the device on the chip, the new non-contact probe setup is based on radiative coupling of vector network analyzer test ports into the coplanar waveguide environment of monolithic devices and integrated circuits via planar, on-chip, broadband antennas. The on-chip antennas act as 'virtual' probe-tips on the test wafer and connect to the device through optimized, impedance matched coplanar waveguide (CPW) lines. Proof-of-concept validation is presented for the 325-750 GHz band using WR2.2 and WR1.5 frequency extender modules and a standard vector network analyzer as the backend. Owing to the non-contact nature, these new probes are free from wear/tear and fragility issues. More importantly, they are low cost and can be easily scaled beyond 900GHz where there is no existing solution for on-wafer device and integrated circuit testing.
KW - millimeter waves
KW - on-wafer measurements
KW - sub-millimeter waves
KW - terahertz
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U2 - 10.1109/MWSYM.2014.6848606
DO - 10.1109/MWSYM.2014.6848606
M3 - Conference contribution
AN - SCOPUS:84905050507
SN - 9781479938698
T3 - IEEE MTT-S International Microwave Symposium Digest
BT - 2014 IEEE MTT-S International Microwave Symposium, IMS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 IEEE MTT-S International Microwave Symposium, IMS 2014
Y2 - 1 June 2014 through 6 June 2014
ER -