Non-contact probes for device and integrated circuit characterization in the THz and mmW bands

Cosan Caglayan, Georgios C. Trichopoulos, Kubilay Sertel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

We present a novel, non-contact, on-wafer device characterization method covering both THz (300 GHz-3 THz) and mmW bands (60-300 GHz). Unlike existing contact probes which rely on fragile tips and physical contact with the device on the chip, the new non-contact probe setup is based on radiative coupling of vector network analyzer test ports into the coplanar waveguide environment of monolithic devices and integrated circuits via planar, on-chip, broadband antennas. The on-chip antennas act as 'virtual' probe-tips on the test wafer and connect to the device through optimized, impedance matched coplanar waveguide (CPW) lines. Proof-of-concept validation is presented for the 325-750 GHz band using WR2.2 and WR1.5 frequency extender modules and a standard vector network analyzer as the backend. Owing to the non-contact nature, these new probes are free from wear/tear and fragility issues. More importantly, they are low cost and can be easily scaled beyond 900GHz where there is no existing solution for on-wafer device and integrated circuit testing.

Original languageEnglish (US)
Title of host publication2014 IEEE MTT-S International Microwave Symposium, IMS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479938698
DOIs
StatePublished - Jan 1 2014
Externally publishedYes
Event2014 IEEE MTT-S International Microwave Symposium, IMS 2014 - Tampa, FL, United States
Duration: Jun 1 2014Jun 6 2014

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Other

Other2014 IEEE MTT-S International Microwave Symposium, IMS 2014
CountryUnited States
CityTampa, FL
Period6/1/146/6/14

Keywords

  • millimeter waves
  • on-wafer measurements
  • sub-millimeter waves
  • terahertz

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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    Caglayan, C., Trichopoulos, G. C., & Sertel, K. (2014). Non-contact probes for device and integrated circuit characterization in the THz and mmW bands. In 2014 IEEE MTT-S International Microwave Symposium, IMS 2014 [6848606] (IEEE MTT-S International Microwave Symposium Digest). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2014.6848606