TY - GEN
T1 - Non-contact probe calibration for THz-frequency device characterization
AU - Caglayan, Cosan
AU - Trichopoulos, Georgios C.
AU - Sertel, Kubilay
PY - 2013/12/1
Y1 - 2013/12/1
N2 - We present a non-contact, on-wafer, broadband device and component testing methodology scalable to the THz band. The 'contactless' probe setup is based on radiative coupling of vector network analyzer test ports onto the coplanar waveguide environment of monolithic devices and integrated circuits. Efficient power coupling is achieved via planar, broadband, antennas that act as the 'virtual' probe-tips on the chip under test. For accurate S-parameter measurements, repeatable errors in the setup are calibrated. In this paper, we demonstrate for the first time experimental validation of the calibration of the new non-contact probes for the 325-500 GHz band (using WR 2.2 frequency extenders and a standard vector network analyzer as the backend). This non-contact probe setup is accurate, low-cost and is readily scalable down to the mmW band and up to the THz band (60GHz-3THz).
AB - We present a non-contact, on-wafer, broadband device and component testing methodology scalable to the THz band. The 'contactless' probe setup is based on radiative coupling of vector network analyzer test ports onto the coplanar waveguide environment of monolithic devices and integrated circuits. Efficient power coupling is achieved via planar, broadband, antennas that act as the 'virtual' probe-tips on the chip under test. For accurate S-parameter measurements, repeatable errors in the setup are calibrated. In this paper, we demonstrate for the first time experimental validation of the calibration of the new non-contact probes for the 325-500 GHz band (using WR 2.2 frequency extenders and a standard vector network analyzer as the backend). This non-contact probe setup is accurate, low-cost and is readily scalable down to the mmW band and up to the THz band (60GHz-3THz).
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U2 - 10.1109/ARFTG-2.2013.6737357
DO - 10.1109/ARFTG-2.2013.6737357
M3 - Conference contribution
AN - SCOPUS:84897731455
SN - 9781467349826
T3 - 82nd ARFTG Microwave Measurement Conference: Characterization, Modeling, and Design of RF and mm-Wave Devices and Circuits, ARFTG 2013
BT - 82nd ARFTG Microwave Measurement Conference
T2 - 82nd ARFTG Microwave Measurement Conference: Characterization, Modeling, and Design of RF and mm-Wave Devices and Circuits, ARFTG 2013
Y2 - 20 November 2013 through 21 November 2013
ER -