TY - GEN
T1 - Nano materials for microelectronic and photonic packaging
AU - Lin, W.
AU - Jiang, H.
AU - Zhang, R.
AU - Liang, Q.
AU - Lu, J.
AU - Xiu, Y.
AU - Moon, K.
AU - Hildreth, O.
AU - Wong, C. P.
PY - 2008
Y1 - 2008
N2 - This paper addresses the state of art nano science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, nano lead-free alloy, molecular wires for electrical interconnects, etc.
AB - This paper addresses the state of art nano science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, nano lead-free alloy, molecular wires for electrical interconnects, etc.
UR - http://www.scopus.com/inward/record.url?scp=77950903664&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77950903664&partnerID=8YFLogxK
U2 - 10.1109/PORTABLE-POLYTRONIC.2008.4681291
DO - 10.1109/PORTABLE-POLYTRONIC.2008.4681291
M3 - Conference contribution
AN - SCOPUS:77950903664
SN - 9781424421411
T3 - PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photon
BT - PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics
T2 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, PORTABLE-POLYTRONIC 2008
Y2 - 17 August 2008 through 20 August 2008
ER -