Nano materials for microelectronic and photonic packaging

W. Lin, H. Jiang, R. Zhang, Q. Liang, J. Lu, Y. Xiu, K. Moon, O. Hildreth, C. P. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper addresses the state of art nano science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, nano lead-free alloy, molecular wires for electrical interconnects, etc.

Original languageEnglish (US)
Title of host publicationPORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics
DOIs
StatePublished - Dec 1 2008
Event2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, PORTABLE-POLYTRONIC 2008 - Garmisch-Partenkirchen, Germany
Duration: Aug 17 2008Aug 20 2008

Publication series

NamePORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photon

Other

Other2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, PORTABLE-POLYTRONIC 2008
CountryGermany
CityGarmisch-Partenkirchen
Period8/17/088/20/08

ASJC Scopus subject areas

  • Information Systems
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics
  • Surfaces, Coatings and Films

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