TY - GEN
T1 - Nano materials and composites for electronic and photo packaging
AU - Li, Yi
AU - Zhang, R.
AU - Zhu, Lingbo
AU - Lin, W.
AU - Hildreth, O.
AU - Jiang, Hongjin
AU - Lu, Jiongxin
AU - Xiu, Yonghao
AU - Liu, Y.
AU - Moon, J.
AU - Wong, C. P.
PY - 2009
Y1 - 2009
N2 - The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and non-conductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, etc. In this presentation, we will review some of the recent advances of polymeric materials and polymer nanocomposites currently being investigated for these types of applications, such as lead-free electrically conductive adhesives (ECAs) for fine pitch and high current density interconnects, flip chip and wafer level underfills, superhydrophobic self-cleaning lotus effect surfaces, as well as high-k and high-Q nanocomposites for embedded capacitors and inductors. These nano materials and process will have important application in electronic and photonic packaging applications.
AB - The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and non-conductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, etc. In this presentation, we will review some of the recent advances of polymeric materials and polymer nanocomposites currently being investigated for these types of applications, such as lead-free electrically conductive adhesives (ECAs) for fine pitch and high current density interconnects, flip chip and wafer level underfills, superhydrophobic self-cleaning lotus effect surfaces, as well as high-k and high-Q nanocomposites for embedded capacitors and inductors. These nano materials and process will have important application in electronic and photonic packaging applications.
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M3 - Conference contribution
AN - SCOPUS:77950979351
SN - 9789810836948
T3 - 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009
SP - 1
EP - 3
BT - 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009
T2 - 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009
Y2 - 26 July 2009 through 30 July 2009
ER -