Nano materials and composites for electronic and photo packaging

Yi Li, R. Zhang, Lingbo Zhu, W. Lin, O. Hildreth, Hongjin Jiang, Jiongxin Lu, Yonghao Xiu, Y. Liu, J. Moon, C. P. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and non-conductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, etc. In this presentation, we will review some of the recent advances of polymeric materials and polymer nanocomposites currently being investigated for these types of applications, such as lead-free electrically conductive adhesives (ECAs) for fine pitch and high current density interconnects, flip chip and wafer level underfills, superhydrophobic self-cleaning lotus effect surfaces, as well as high-k and high-Q nanocomposites for embedded capacitors and inductors. These nano materials and process will have important application in electronic and photonic packaging applications.

Original languageEnglish (US)
Title of host publication2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009
Pages1-3
Number of pages3
StatePublished - 2009
Externally publishedYes
Event2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009 - Genoa, Italy
Duration: Jul 26 2009Jul 30 2009

Other

Other2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009
CountryItaly
CityGenoa
Period7/26/097/30/09

Fingerprint

Packaging
Cleaning
Adhesives
Nanocomposites
Polymers
Composite materials
Dielectric losses
Photonics
Capacitors
Current density
Semiconductor materials
Lead
Low-k dielectric

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering

Cite this

Li, Y., Zhang, R., Zhu, L., Lin, W., Hildreth, O., Jiang, H., ... Wong, C. P. (2009). Nano materials and composites for electronic and photo packaging. In 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009 (pp. 1-3). [5394551]

Nano materials and composites for electronic and photo packaging. / Li, Yi; Zhang, R.; Zhu, Lingbo; Lin, W.; Hildreth, O.; Jiang, Hongjin; Lu, Jiongxin; Xiu, Yonghao; Liu, Y.; Moon, J.; Wong, C. P.

2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009. 2009. p. 1-3 5394551.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Li, Y, Zhang, R, Zhu, L, Lin, W, Hildreth, O, Jiang, H, Lu, J, Xiu, Y, Liu, Y, Moon, J & Wong, CP 2009, Nano materials and composites for electronic and photo packaging. in 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009., 5394551, pp. 1-3, 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009, Genoa, Italy, 7/26/09.
Li Y, Zhang R, Zhu L, Lin W, Hildreth O, Jiang H et al. Nano materials and composites for electronic and photo packaging. In 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009. 2009. p. 1-3. 5394551
Li, Yi ; Zhang, R. ; Zhu, Lingbo ; Lin, W. ; Hildreth, O. ; Jiang, Hongjin ; Lu, Jiongxin ; Xiu, Yonghao ; Liu, Y. ; Moon, J. ; Wong, C. P. / Nano materials and composites for electronic and photo packaging. 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009. 2009. pp. 1-3
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