Multiscale modeling of bonded t-joints using atomistically informed method of cells

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this research, a multiscale modeling framework is developed and applied to the analysis of adhesively bonded composite joints under mechanical loading. The primary goal is to obtain an improved understanding of damage initiation and failure at the relevant length scales and predicting the consequent effects at the structural scale. The methodology utilizes damage information at the atomic level, addressed using molecular dynamics (MD), and couples it with a method of cells based micromechanics model for the nonlinear and damage analysis of carbon fiber reinforced polymer (CFRP) composite. This damage analysis technique is then used to predict the multiscale nonlinear effects in hot-spot zones, such as the adhesive/adherend interface, in adhesively bonded T-joints which will assist in the development of methods for prevention or delay of the most common forms of failure in such built-up components.

Original languageEnglish (US)
Title of host publication33rd Technical Conference of the American Society for Composites 2018
PublisherDEStech Publications Inc.
Pages2243-2253
Number of pages11
Volume4
ISBN (Electronic)9781510872073
StatePublished - Jan 1 2018
Event33rd Technical Conference of the American Society for Composites 2018 - Seattle, United States
Duration: Sep 24 2018Sep 27 2018

Other

Other33rd Technical Conference of the American Society for Composites 2018
CountryUnited States
CitySeattle
Period9/24/189/27/18

Fingerprint

Micromechanics
Composite materials
Carbon fibers
Molecular dynamics
Adhesives
Polymers
carbon fiber

ASJC Scopus subject areas

  • Mechanics of Materials
  • Surfaces, Coatings and Films
  • Metals and Alloys

Cite this

Rai, A., & Chattopadhyay, A. (2018). Multiscale modeling of bonded t-joints using atomistically informed method of cells. In 33rd Technical Conference of the American Society for Composites 2018 (Vol. 4, pp. 2243-2253). DEStech Publications Inc..

Multiscale modeling of bonded t-joints using atomistically informed method of cells. / Rai, Ashwin; Chattopadhyay, Aditi.

33rd Technical Conference of the American Society for Composites 2018. Vol. 4 DEStech Publications Inc., 2018. p. 2243-2253.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rai, A & Chattopadhyay, A 2018, Multiscale modeling of bonded t-joints using atomistically informed method of cells. in 33rd Technical Conference of the American Society for Composites 2018. vol. 4, DEStech Publications Inc., pp. 2243-2253, 33rd Technical Conference of the American Society for Composites 2018, Seattle, United States, 9/24/18.
Rai A, Chattopadhyay A. Multiscale modeling of bonded t-joints using atomistically informed method of cells. In 33rd Technical Conference of the American Society for Composites 2018. Vol. 4. DEStech Publications Inc. 2018. p. 2243-2253
Rai, Ashwin ; Chattopadhyay, Aditi. / Multiscale modeling of bonded t-joints using atomistically informed method of cells. 33rd Technical Conference of the American Society for Composites 2018. Vol. 4 DEStech Publications Inc., 2018. pp. 2243-2253
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