Multiscale microstructural characterization of Sn-rich alloys by three dimensional (3D) X-ray synchrotron tomography and focused ion beam (FIB) tomography

K. E. Yazzie, J. J. Williams, N. C. Phillips, F. De Carlo, Nikhilesh Chawla

Research output: Contribution to journalArticle

29 Scopus citations

Abstract

Sn-rich (Pb-free) alloys serve as electrical and mechanical interconnects in electronic packaging. It is critical to quantify the microstructures of Sn-rich alloys to obtain a fundamental understanding of their properties. In this work, the intermetallic precipitates in Sn-3.5Ag and Sn-0.7Cu, and globular lamellae in Sn-37Pb solder joints were visualized and quantified using 3D X-ray synchrotron tomography and focused ion beam (FIB) tomography. 3D reconstructions were analyzed to extract statistics on particle size and spatial distribution. In the Sn-Pb alloy the interconnectivity of Sn-rich and Pb-rich constituents was quantified. It will be shown that multiscale characterization using 3D X-ray and FIB tomography enabled the characterization of the complex morphology, distribution, and statistics of precipitates and contiguous phases over a range of length scales.

Original languageEnglish (US)
Pages (from-to)33-41
Number of pages9
JournalMaterials Characterization
Volume70
DOIs
StatePublished - Aug 1 2012

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Keywords

  • 3D materials science
  • Focused ion beam tomography
  • Pb-free solder
  • X-ray tomography

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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