Abstract

We present here a fully coupled flux-based electro-thermal simulation package. We simulate the electrical characteristics using a full-band Cellular Monte Carlo approach (CMC), which calculates the heat generation rate within each computational cell directly from the energy exchanged through electron-phonon scattering events. We then use this calculated generation rate in a flux-based thermal solver producing physically realistic temperature maps for both optical and acoustic modes by solving a Poisson-like equation for each respectively. The resulting temperature map is then used to update scattering rates reflecting the local temperature in each individual cell. In addition, temperature-dependent thermal conductivities are included using the Kirchhoff Transformation, which implicitly includes the temperature dependence in a new apparent temperature variable while allowing us to solve a Poisson-like linear elliptical partial differential equation.

Original languageEnglish (US)
Title of host publicationTHERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538667590
DOIs
StatePublished - Dec 27 2018
Event24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 - Stockholm, Sweden
Duration: Sep 26 2018Sep 28 2018

Publication series

NameTHERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

Conference

Conference24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018
CountrySweden
CityStockholm
Period9/26/189/28/18

Fingerprint

Electron devices
thermal simulation
electrons
Temperature
temperature
Fluxes
heat generation
Poisson equation
Phonon scattering
cells
scattering
Electron scattering
partial differential equations
Heat generation
thermal conductivity
Partial differential equations
Hot Temperature
Thermal conductivity
temperature dependence
Scattering

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering

Cite this

Merrill, K., & Saraniti, M. (2018). Multiscale Coupled Electro-Thermal Simulations of Electron Devices. In THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings [8593320] (THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2018.8593320

Multiscale Coupled Electro-Thermal Simulations of Electron Devices. / Merrill, Ky; Saraniti, Marco.

THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. 8593320 (THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Merrill, K & Saraniti, M 2018, Multiscale Coupled Electro-Thermal Simulations of Electron Devices. in THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 8593320, THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings, Institute of Electrical and Electronics Engineers Inc., 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018, Stockholm, Sweden, 9/26/18. https://doi.org/10.1109/THERMINIC.2018.8593320
Merrill K, Saraniti M. Multiscale Coupled Electro-Thermal Simulations of Electron Devices. In THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. 8593320. (THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings). https://doi.org/10.1109/THERMINIC.2018.8593320
Merrill, Ky ; Saraniti, Marco. / Multiscale Coupled Electro-Thermal Simulations of Electron Devices. THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. (THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings).
@inproceedings{cb76174d09cb454ca0979fed82d4a9ec,
title = "Multiscale Coupled Electro-Thermal Simulations of Electron Devices",
abstract = "We present here a fully coupled flux-based electro-thermal simulation package. We simulate the electrical characteristics using a full-band Cellular Monte Carlo approach (CMC), which calculates the heat generation rate within each computational cell directly from the energy exchanged through electron-phonon scattering events. We then use this calculated generation rate in a flux-based thermal solver producing physically realistic temperature maps for both optical and acoustic modes by solving a Poisson-like equation for each respectively. The resulting temperature map is then used to update scattering rates reflecting the local temperature in each individual cell. In addition, temperature-dependent thermal conductivities are included using the Kirchhoff Transformation, which implicitly includes the temperature dependence in a new apparent temperature variable while allowing us to solve a Poisson-like linear elliptical partial differential equation.",
author = "Ky Merrill and Marco Saraniti",
year = "2018",
month = "12",
day = "27",
doi = "10.1109/THERMINIC.2018.8593320",
language = "English (US)",
series = "THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings",

}

TY - GEN

T1 - Multiscale Coupled Electro-Thermal Simulations of Electron Devices

AU - Merrill, Ky

AU - Saraniti, Marco

PY - 2018/12/27

Y1 - 2018/12/27

N2 - We present here a fully coupled flux-based electro-thermal simulation package. We simulate the electrical characteristics using a full-band Cellular Monte Carlo approach (CMC), which calculates the heat generation rate within each computational cell directly from the energy exchanged through electron-phonon scattering events. We then use this calculated generation rate in a flux-based thermal solver producing physically realistic temperature maps for both optical and acoustic modes by solving a Poisson-like equation for each respectively. The resulting temperature map is then used to update scattering rates reflecting the local temperature in each individual cell. In addition, temperature-dependent thermal conductivities are included using the Kirchhoff Transformation, which implicitly includes the temperature dependence in a new apparent temperature variable while allowing us to solve a Poisson-like linear elliptical partial differential equation.

AB - We present here a fully coupled flux-based electro-thermal simulation package. We simulate the electrical characteristics using a full-band Cellular Monte Carlo approach (CMC), which calculates the heat generation rate within each computational cell directly from the energy exchanged through electron-phonon scattering events. We then use this calculated generation rate in a flux-based thermal solver producing physically realistic temperature maps for both optical and acoustic modes by solving a Poisson-like equation for each respectively. The resulting temperature map is then used to update scattering rates reflecting the local temperature in each individual cell. In addition, temperature-dependent thermal conductivities are included using the Kirchhoff Transformation, which implicitly includes the temperature dependence in a new apparent temperature variable while allowing us to solve a Poisson-like linear elliptical partial differential equation.

UR - http://www.scopus.com/inward/record.url?scp=85061510586&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85061510586&partnerID=8YFLogxK

U2 - 10.1109/THERMINIC.2018.8593320

DO - 10.1109/THERMINIC.2018.8593320

M3 - Conference contribution

T3 - THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

BT - THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

ER -