TY - JOUR
T1 - Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition
T2 - Effect of nozzle speed and diameter
AU - Morsali, Seyedreza
AU - Daryadel, Soheil
AU - Zhou, Zhong
AU - Behroozfar, Ali
AU - Baniasadi, Mahmoud
AU - Moreno, Salvador
AU - Qian, Dong
AU - Minary-Jolandan, Majid
N1 - Publisher Copyright:
© 2017 Author(s).
PY - 2017/6/7
Y1 - 2017/6/7
N2 - Meniscus-confined electrodeposition (MCED) is a solution-based, room temperature process for 3D printing of metals at micro/nanoscale. In this process, a meniscus (liquid bridge or capillary) between a nozzle and a substrate governs the localized electrodeposition process, which involves multiple physics of electrodeposition, fluid dynamics, mass, and heat transfer. We have developed a multiphysics finite element (FE) model to investigate the effects of nozzle speed (v N) and nozzle diameter (D0) in the MCED process. The simulation results are validated with experimental data. Based on theoretical approach and experimental observation, the diameter of the deposited wire is in the range of 0.5-0.9 times of the nozzle diameter. The applicable range for vN for various nozzle diameters is computed. The results showed that the contribution of migration flux to total flux remains nearly constant (∼50%) for all values of pipette diameter in the range examined (100 nm-5 μm), whereas the contribution of diffusion and evaporation fluxes to total flux increase and decrease with the increasing pipette diameter, respectively. Results of this multiphysics study can be used to guide the experiment for optimal process conditions.
AB - Meniscus-confined electrodeposition (MCED) is a solution-based, room temperature process for 3D printing of metals at micro/nanoscale. In this process, a meniscus (liquid bridge or capillary) between a nozzle and a substrate governs the localized electrodeposition process, which involves multiple physics of electrodeposition, fluid dynamics, mass, and heat transfer. We have developed a multiphysics finite element (FE) model to investigate the effects of nozzle speed (v N) and nozzle diameter (D0) in the MCED process. The simulation results are validated with experimental data. Based on theoretical approach and experimental observation, the diameter of the deposited wire is in the range of 0.5-0.9 times of the nozzle diameter. The applicable range for vN for various nozzle diameters is computed. The results showed that the contribution of migration flux to total flux remains nearly constant (∼50%) for all values of pipette diameter in the range examined (100 nm-5 μm), whereas the contribution of diffusion and evaporation fluxes to total flux increase and decrease with the increasing pipette diameter, respectively. Results of this multiphysics study can be used to guide the experiment for optimal process conditions.
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U2 - 10.1063/1.4984910
DO - 10.1063/1.4984910
M3 - Article
AN - SCOPUS:85020472427
SN - 0021-8979
VL - 121
JO - Journal of Applied Physics
JF - Journal of Applied Physics
IS - 21
M1 - 214305
ER -