MULTI-LAYER MULTI-CONDUCTOR MICRO-STRIPS FOR DIGITAL INTEGRATED CIRCUITS

The design of microwave integrated circuit devices (MIC's) requires careful control of coupling, and reduction of crosstalk between conductors. Usually, these are accomplished by control of the spacing between the center conductors and introduction of capacitive elements that equate phase velocities among other measures. In the current state of the art, ultrafast switching speeds and decreasing circuit dimensions of MIC's emphasize the dispersive nature of these printed circuit transmission lines. This increase in dispersive behavior can result in significant distortion on signals that travel only a short distance in an MIC line. Researchers at Arizona State University have developed a new invention that utilizes special multilayer substrates to accomplish improved coupling control along with increase of directivity, and reduction of cross talk and signal distortion over a very broad frequency range. The main advantages of this method are that the pattern of the center conductors is exposed which allows integration of active and passive elements, and ease of fabrication of the devices. In addition the spacing between the center conductors required to accomplish some designs using other methods may be too large, however the same device performance can be accomplished using this new method with smaller spacings between the center conductors which lead to devices with smaller overall dimensions.