TY - GEN
T1 - Molecular Electronic Transducer Based Tilting Sensors
AU - Liang, Mengbing
AU - Nickerson, Stella
AU - Dai, Lenore
AU - Yu, Hongyu
N1 - Funding Information:
We gratefully acknowledge the financial support from NASA NNX14AI41G and the Fulton Undergraduate Research Initiative at Arizona State University.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - This paper introduces a tilting sensor based on Molecular Electronic Transducer (MET) technology. By applying electrical potential between two electrodes covered by lithium iodide electrolyte, the output current from the sensor reflects the covered area of electrodes. The continuously change of electrode area with tilting angle is achieved by patterning metal traces on top of a SiO2 encapsulated silicon wafer. Polydimethylsiloxane (PDMS) is used as the electrolyte chamber which has high bond strength with SiO2 after the surface treatment with O2 plasma. The MET tilting sensor achieves a promising performance with a linear range of ± 90°, resolution of 0.184° and time constant of 40s.
AB - This paper introduces a tilting sensor based on Molecular Electronic Transducer (MET) technology. By applying electrical potential between two electrodes covered by lithium iodide electrolyte, the output current from the sensor reflects the covered area of electrodes. The continuously change of electrode area with tilting angle is achieved by patterning metal traces on top of a SiO2 encapsulated silicon wafer. Polydimethylsiloxane (PDMS) is used as the electrolyte chamber which has high bond strength with SiO2 after the surface treatment with O2 plasma. The MET tilting sensor achieves a promising performance with a linear range of ± 90°, resolution of 0.184° and time constant of 40s.
KW - Molecular Electronic Transducer
KW - PDMS
KW - Tilt Sensor
UR - http://www.scopus.com/inward/record.url?scp=85083206516&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85083206516&partnerID=8YFLogxK
U2 - 10.1109/MEMS46641.2020.9056211
DO - 10.1109/MEMS46641.2020.9056211
M3 - Conference contribution
AN - SCOPUS:85083206516
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 765
EP - 768
BT - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Y2 - 18 January 2020 through 22 January 2020
ER -