TY - GEN
T1 - Molecular dynamics study for self-sensing/self-healing materials to simulate damage detection and repair in thermoset polymer matrix
AU - Koo, Bonsung
AU - Gunkel, Ryan
AU - Chattopadhyay, Aditi
AU - Dai, Lenore
N1 - Funding Information:
The authors are grateful for the support of the Army Research Office, number: W911NF-15-1-0072. Dr. David Stepp is the program manager.
Funding Information:
The force field MMFF validated by chemists and crystallographers [8, 13-16] has been employed and topology information has been generated through a web-based molecular structure generator, which is supported by Swiss Institute of Bioinformatics (SIB) – an international research foundation providing organic chemistry resources [11]. Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) has been used to calculate the potential energy of the system based on the topology information.
Publisher Copyright:
© Copyright© (2018) by DEStech Publications, Inc. All rights reserved.
PY - 2018
Y1 - 2018
N2 - The mechanochemical response of a novel cyclobutane-based mechanophore (force-sensitive molecule) covalently bonded with an epoxy-based thermoset polymer matrix is characterized by experiments and modeling. This new mechanophore consists of one cyclobutane (stress-sensitive molecular unit) and six amine groups (epoxy curing agents) that enable the cyclobutane to be connected to epoxy network chemically. Thereby the external force applied to mechanophores directly through the epoxy network, which makes the sensitivity of mechanophore to the external stimulation improved. Furthermore, the mechanical properties of epoxy can be preserved since mechanophores are connected to the host materials chemically, not embedded physically. The experimental results indicated that the yield strength slightly increased compared to the neat epoxy with improved optical response of mechanophore to the external mechanical loads. In parallel, molecular model of this new mechanophore embedded thermoset polymer system has been developed. Numerical simulations correctly capture the effect of the new mechanophore on the improvement in sensitivity of mechanophore activation and mechanical properties; the modeling framework is validated experimentally.
AB - The mechanochemical response of a novel cyclobutane-based mechanophore (force-sensitive molecule) covalently bonded with an epoxy-based thermoset polymer matrix is characterized by experiments and modeling. This new mechanophore consists of one cyclobutane (stress-sensitive molecular unit) and six amine groups (epoxy curing agents) that enable the cyclobutane to be connected to epoxy network chemically. Thereby the external force applied to mechanophores directly through the epoxy network, which makes the sensitivity of mechanophore to the external stimulation improved. Furthermore, the mechanical properties of epoxy can be preserved since mechanophores are connected to the host materials chemically, not embedded physically. The experimental results indicated that the yield strength slightly increased compared to the neat epoxy with improved optical response of mechanophore to the external mechanical loads. In parallel, molecular model of this new mechanophore embedded thermoset polymer system has been developed. Numerical simulations correctly capture the effect of the new mechanophore on the improvement in sensitivity of mechanophore activation and mechanical properties; the modeling framework is validated experimentally.
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M3 - Conference contribution
AN - SCOPUS:85059320779
T3 - 33rd Technical Conference of the American Society for Composites 2018
SP - 462
EP - 473
BT - 33rd Technical Conference of the American Society for Composites 2018
PB - DEStech Publications Inc.
T2 - 33rd Technical Conference of the American Society for Composites 2018
Y2 - 24 September 2018 through 27 September 2018
ER -