Molecular dynamics simulations of mechanical deformation of amorphous silicon dioxide during chemical-mechanical polishing

The molecular dynamics simulations of mechanical deformation of amorphous silicon dioxide during chemical-mechanical polishing were analyzed. The simulations clarify asperity shape evolution during the process of shear and reveal temperature distributions as a function of time. An analytic model was developed for describing the amount of material removed as a function of asperity and particle radii and relative velocity.