Abstract

Severe adhesive wear on a rough aluminum (Al) substrate is simulated by a hard Lennard-Jones asperity impacting an Al-asperity at high speeds using molecular dynamics (MD). Multiple simulations investigate the effects of variations in the inter-asperity bonding, the geometric overlap between two asperities, the relative impact velocity and the starting temperature. The effect of these experimental variables on degree of adhesive wear and the temperature profiles are discussed, and a design of experiments method is used to help interpret the results. The results indicate that increasing the inter-asperity bonding, the geometric overlap and the starting temperature of two asperities will substantially increase the wear rate, while raising the impact velocity slightly decreases the wear rate. It is observed that the deformation mechanism involves local melting and the formation of a liquid like layer in the contact area between two asperities, and the amorphous deformation of the Al-asperity.

Original languageEnglish (US)
Article number055307
JournalJournal of Physics D: Applied Physics
Volume46
Issue number5
DOIs
StatePublished - Feb 6 2013

Fingerprint

Aluminum
adhesives
Molecular dynamics
Adhesives
Wear of materials
molecular dynamics
aluminum
impact velocity
Computer simulation
Substrates
simulation
experiment design
temperature profiles
Design of experiments
Contacts (fluid mechanics)
Temperature
Melting
melting
high speed
temperature

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials
  • Acoustics and Ultrasonics
  • Surfaces, Coatings and Films

Cite this

Molecular dynamics simulation of severe adhesive wear on a rough aluminum substrate. / Zhong, Jun; Shakiba, Robab; Adams, James.

In: Journal of Physics D: Applied Physics, Vol. 46, No. 5, 055307, 06.02.2013.

Research output: Contribution to journalArticle

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