TY - GEN
T1 - Modeling within-die spatial correlation effects for process-design co-optimization
AU - Friedberg, Paul
AU - Cao, Yu
AU - Cain, Jason
AU - Wang, Ruth
AU - Rabaey, Jan
AU - Spanos, Costas
PY - 2005/12/1
Y1 - 2005/12/1
N2 - Within-die spatial correlation of device parameter values caused by manufacturing variations has a significant impact on circuit performance. Based on experimental and simulation results, we: (1) characterize the spatial correlation of gate length over a full-field range of horizontal and vertical separation; (2) develop a rudimentary spatial correlation model; and (3) investigate its impact an the variability of circuit performance.
AB - Within-die spatial correlation of device parameter values caused by manufacturing variations has a significant impact on circuit performance. Based on experimental and simulation results, we: (1) characterize the spatial correlation of gate length over a full-field range of horizontal and vertical separation; (2) develop a rudimentary spatial correlation model; and (3) investigate its impact an the variability of circuit performance.
UR - http://www.scopus.com/inward/record.url?scp=84886673851&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84886673851&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2005.82
DO - 10.1109/ISQED.2005.82
M3 - Conference contribution
AN - SCOPUS:84886673851
SN - 0769523013
SN - 9780769523019
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 516
EP - 521
BT - Proceedings - 6th International Symposium on Quality Electronic Design, ISQED 2005
T2 - 6th International Symposium on Quality Electronic Design, ISQED 2005
Y2 - 21 March 2005 through 23 March 2005
ER -