Abstract

In this paper, a review is presented on the self-heating modeling efforts performed at Arizona State University. In the analysis, first simple SOI Devices are being considered from different technology generations to illustrate what we call Thermal Landauer picture. Namely, it is demonstrated via numerical simulations that in the shortest devices the hot spot does not occur in the channel (as it was speculated in previous works), but occurs in the drain contact due to the largely ballistic nature of the carrier transport. Impact of self-heating effects is also examined in dual-gate devices and silicon nanowire transistors.

Original languageEnglish (US)
Title of host publicationIEEE-NANO 2015 - 15th International Conference on Nanotechnology
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages200-203
Number of pages4
ISBN (Print)9781467381550
DOIs
StatePublished - Jan 20 2016
Event15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015 - Rome, Italy
Duration: Jul 27 2015Jul 30 2015

Other

Other15th IEEE International Conference on Nanotechnology, IEEE-NANO 2015
CountryItaly
CityRome
Period7/27/157/30/15

Keywords

  • Monte Carlo device simulations
  • phonons
  • self-heating effects
  • semiconductor devices

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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  • Cite this

    Vasileska, D. (2016). Modeling self-heating in nanoscale devices. In IEEE-NANO 2015 - 15th International Conference on Nanotechnology (pp. 200-203). [7388957] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NANO.2015.7388957