Modeling of intra-die process variations for accurate analysis and optimization of nano-scale circuits

Sarvesh Bhardwaj, Sarma Vrudhula, Praveen Ghanta, Yu Cao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

36 Citations (Scopus)

Abstract

This paper proposes the use of Karhunen-Loève Expansion (KLE) for accurate and efficient modeling of intra-die correlations in the semiconductor manufacturing process. We demonstrate that the KLE provides a significantly more accurate representation of the underlying stochastic process compared to the traditional approach of dividing the layout into grids and applying Principal Component Analysis (PCA). By comparing the results of leakage analysis using both KLE and the existing approaches, we show that using KLE can provide up to 4-5x reduction in the variability space (number of random variables) while maintaining the same accuracy. We also propose an efficient leakage minimization algorithm that maximizes the leakage yield while satisfying probabilistic constraints on the delay.

Original languageEnglish (US)
Title of host publicationProceedings - Design Automation Conference
Pages791-796
Number of pages6
DOIs
StatePublished - 2006

Fingerprint

Networks (circuits)
Random processes
Random variables
Principal component analysis
Semiconductor materials

Keywords

  • Correlations
  • Intra-die
  • Karhunen-Loeve
  • Leakage
  • Process variations
  • Statistical

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

Cite this

Modeling of intra-die process variations for accurate analysis and optimization of nano-scale circuits. / Bhardwaj, Sarvesh; Vrudhula, Sarma; Ghanta, Praveen; Cao, Yu.

Proceedings - Design Automation Conference. 2006. p. 791-796.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bhardwaj, Sarvesh ; Vrudhula, Sarma ; Ghanta, Praveen ; Cao, Yu. / Modeling of intra-die process variations for accurate analysis and optimization of nano-scale circuits. Proceedings - Design Automation Conference. 2006. pp. 791-796
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