Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes

Chen Fu Chien, Stéphane Dauzère-Pérès, Hans Ehm, John Fowler, Zhibin Jiang, Shekar Krishnaswamy, Lars Mönch, Reha Uzsoy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations

Abstract

A panel session on the role of modeling and analysis in semiconductor manufacturing in a shrinking world is presented. Therefore, two participants are from Asia, two from Europe, and two from US and there are two panel organizers/ moderators (Fowler and Mönch). One panelist from each continent is from industry and one from academia. Only initial position statements are included in the proceedings. However, these initial statements form the basis for the panel discussion. The statements of the panelists from industry relate to modeling and analysis problems found in their own companies. The position statements of the panelists from academia describe the role that modeling and analysis is expected to play in their current and ongoing research in semiconductor manufacturing. Furthermore, their views on the challenges and successes of modeling and analysis in a globalized world are also included.

Original languageEnglish (US)
Title of host publicationProceedings of the 2008 Winter Simulation Conference, WSC 2008
Pages2093-2099
Number of pages7
DOIs
StatePublished - Dec 1 2008
Event2008 Winter Simulation Conference, WSC 2008 - Miami, FL, United States
Duration: Dec 7 2008Dec 10 2008

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Other

Other2008 Winter Simulation Conference, WSC 2008
CountryUnited States
CityMiami, FL
Period12/7/0812/10/08

ASJC Scopus subject areas

  • Software
  • Modeling and Simulation
  • Computer Science Applications

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    Chien, C. F., Dauzère-Pérès, S., Ehm, H., Fowler, J., Jiang, Z., Krishnaswamy, S., Mönch, L., & Uzsoy, R. (2008). Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes. In Proceedings of the 2008 Winter Simulation Conference, WSC 2008 (pp. 2093-2099). [4736306] (Proceedings - Winter Simulation Conference). https://doi.org/10.1109/WSC.2008.4736306