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Microwave assisted low temperature encapsulation of Ag films by Cu reactions using Ag-Cu alloy structures
Sayantan Das,
Terry Alford
Materials Science and Engineering
Mechanical and Aerospace Engineering
Chemical Engineering
Connection One (C1)
Knowledge Enterprise (KE)
Engineering of Matter, Transport and Energy, School for (IAFSE-SEMTE)
Research output
:
Contribution to journal
›
Article
›
peer-review
4
Scopus citations
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Engineering & Materials Science
Encapsulation
100%
Rutherford backscattering spectroscopy
81%
Microwaves
77%
Copper oxides
63%
Flexible electronics
61%
Spectrometry
57%
Annealing
43%
X ray diffraction
43%
Thin films
41%
Oxides
37%
Copper
35%
Temperature
35%
Chemical Compounds
Encapsulation
76%
Microwave
71%
Alloy
61%
Rutherford Backscattering Spectroscopy
56%
Copper Oxide
48%
Liquid Film
42%
Annealing
34%
Probe
26%
Oxide
23%
X-Ray Diffraction
21%
Physics & Astronomy
microwaves
59%
copper oxides
51%
backscattering
39%
copper
31%
electrical resistivity
27%
oxides
27%
cavities
27%
probes
26%
annealing
26%
diffraction
23%
spectroscopy
23%
electronics
22%
thin films
22%
x rays
19%
temperature
13%