Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

Nikhilesh Chawla, R. S. Sidhu

Research output: Chapter in Book/Report/Conference proceedingChapter

4 Scopus citations

Abstract

The mechanical properties of Sn-rich solder alloys are directly related to their heterogeneous microstructure. Thus, numerical modeling of the properties of these alloys is most effective when the microstructure is explicitly incorporated into the model. In this review, we provide several examples where 2D and 3D microstructures have been used to model the material behavior using finite element modeling. These included (a) 3D visualization of the solder microstructure, (b) 3D microstructure-based modeling of tensile behavior, (c) 2D modeling of the effect of intermetallic volume fraction and morphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.

Original languageEnglish (US)
Title of host publicationLead-Free Electronic Solders
Subtitle of host publicationA Special Issue of the Journal of Materials Science: Materials in Electronics
PublisherSpringer US
Pages175-189
Number of pages15
ISBN (Print)0387484310, 9780387484310
DOIs
StatePublished - Dec 1 2007

ASJC Scopus subject areas

  • Engineering(all)

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    Chawla, N., & Sidhu, R. S. (2007). Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys. In Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics (pp. 175-189). Springer US. https://doi.org/10.1007/978-0-387-48433-4_11