The mechanical properties of Sn-rich solder alloys are directly related to their heterogeneous microstructure. Thus, numerical modeling of the properties of these alloys is most effective when the microstructure is explicitly incorporated into the model. In this review, we provide several examples where 2D and 3D microstructures have been used to model the material behavior using finite element modeling. These included (a) 3D visualization of the solder microstructure, (b) 3D microstructure-based modeling of tensile behavior, (c) 2D modeling of the effect of intermetallic volume fraction and morphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.
|Original language||English (US)|
|Title of host publication||Lead-Free Electronic Solders|
|Subtitle of host publication||A Special Issue of the Journal of Materials Science: Materials in Electronics|
|Number of pages||15|
|ISBN (Print)||0387484310, 9780387484310|
|State||Published - Dec 1 2007|
ASJC Scopus subject areas