Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

Nikhilesh Chawla, R. S. Sidhu

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

The mechanical properties of Sn-rich solder alloys are directly related to their heterogeneous microstructure. Thus, numerical modeling of the properties of these alloys is most effective when the microstructure is explicitly incorporated into the model. In this review, we provide several examples where 2D and 3D microstructures have been used to model the material behavior using finite element modeling. These included (a) 3D visualization of the solder microstructure, (b) 3D microstructure-based modeling of tensile behavior, (c) 2D modeling of the effect of intermetallic volume fraction and morphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.

Original languageEnglish (US)
Pages (from-to)175-189
Number of pages15
JournalJournal of Materials Science: Materials in Electronics
Volume18
Issue number1-3
DOIs
StatePublished - Mar 2007

Fingerprint

solders
Joints
Soldering alloys
microstructure
Microstructure
Growth
Intermetallics
intermetallics
Lead-free solders
Crack propagation
Volume fraction
Visualization
cracks
mechanical properties
shear
Mechanical properties
predictions

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys. / Chawla, Nikhilesh; Sidhu, R. S.

In: Journal of Materials Science: Materials in Electronics, Vol. 18, No. 1-3, 03.2007, p. 175-189.

Research output: Contribution to journalArticle

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