Microstructure and stability of sputtered titanium aluminides on SiO 2

H. C. Kim, N. D. Theodore, K. S. Gadre, Terry Alford

Research output: Contribution to journalArticle

Abstract

Ti37Al63 and Ti53Al47 thin films are deposited onto SiO2 by sputtering and then annealed to investigate their properties for applications in high-temperature electronics. The films show good thermal stability and reasonable electrical resistivity. Different microstructures and phases are obtained as different film compositions and anneal conditions are used.

Original languageEnglish (US)
Pages (from-to)517-521
Number of pages5
JournalScripta Materialia
Volume50
Issue number4
DOIs
StatePublished - Feb 1 2004

Keywords

  • Characterization
  • Microstructure
  • Sputtering
  • Titanium aluminide thin films

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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