Microstructure and stability of sputtered titanium aluminides on SiO 2

H. C. Kim; N. D. Theodore; K. S. Gadre; Terry Alford

doi:10.1016/j.scriptamat.2003.10.022

Microstructure and stability of sputtered titanium aluminides on SiO ₂

H. C. Kim, N. D. Theodore, K. S. Gadre, Terry Alford

Research output: Contribution to journal › Article › peer-review

Abstract

Ti₃₇Al₆₃ and Ti₅₃Al₄₇ thin films are deposited onto SiO₂ by sputtering and then annealed to investigate their properties for applications in high-temperature electronics. The films show good thermal stability and reasonable electrical resistivity. Different microstructures and phases are obtained as different film compositions and anneal conditions are used.

Original language	English (US)
Pages (from-to)	517-521
Number of pages	5
Journal	Scripta Materialia
Volume	50
Issue number	4
DOIs	https://doi.org/10.1016/j.scriptamat.2003.10.022
State	Published - Feb 2004

Keywords

Characterization
Microstructure
Sputtering
Titanium aluminide thin films

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/j.scriptamat.2003.10.022

Cite this

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title = "Microstructure and stability of sputtered titanium aluminides on SiO 2",

abstract = "Ti37Al63 and Ti53Al47 thin films are deposited onto SiO2 by sputtering and then annealed to investigate their properties for applications in high-temperature electronics. The films show good thermal stability and reasonable electrical resistivity. Different microstructures and phases are obtained as different film compositions and anneal conditions are used.",

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KW - Sputtering

KW - Titanium aluminide thin films

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