Microstructure and mechanical strength of snag-based solid liquid inter-diffusion bonds for 3 dimensional integrated circuits

Engineering & Materials Science

• Interdiffusion (solids) 100%
• Intermetallics 59%
• Strength of materials 58%
• Integrated circuits 51%
• Microstructure 37%
• Liquids 37%
• Copper 13%
• Diffraction patterns 11%
• X-Ray Emission Spectrometry 10%
• Temperature 9%
• X ray diffraction 7%
• Electron microscopes 7%
• Ductility 7%
• Scanning 6%
• Fabrication 5%
• Chemical analysis 5%
• Experiments 2%

Chemical Compounds

• Interdiffusion 87%
• Microstructure 37%
• Strength 35%
• Liquid 30%
• Pressure 16%
• Time 13%
• Chemical Transformation 11%
• Ductility 10%
• Intermetallic Compound 9%
• Energy Dispersive X-Ray Spectroscopy 8%
• Reduction 8%
• Chemical Element 7%
• Diffusion 5%
• Electron Particle 5%
• X-Ray Diffraction 4%

Physics & Astronomy

• integrated circuits 53%
• intermetallics 50%
• microstructure 32%
• liquids 29%
• copper 11%
• factorials 10%
• test equipment 8%
• high strength 8%
• microbalances 8%
• ductility 7%
• x rays 7%
• time lag 6%
• diffraction patterns 6%
• electron microscopes 6%
• scanning 5%
• fabrication 4%
• temperature 4%
• estimates 4%
• spectroscopy 4%
• energy 2%