Microstructural Optimization Approach of Solar Cell Interconnectors Fatigue Behavior for Enhanced Module Lifetime in Extreme Climates

Rico MEIER, Matthias Pander, Stephan Großer, Sascha Dietrich

Research output: Contribution to journalConference article

3 Citations (Scopus)

Abstract

Fatigue of the cell interconnectors is one of the main reasons for module failure. Especially with respect to module application in extreme climates new demands on solar cell interconnectors will arise. Optimizations in the manufacturing process to generate a product demand related microstructure are a key to improve the material behavior of interconnectors with respect to extreme climate loading conditions without increasing costs. For achieving this goal several aspects were considered in this paper: Influence of the annealing process on the fatigue behavior: Due to an optimization of the annealing process an increase in ribbon fatigue strength by a factor of four could be achieved. The effect consists of two parts: Firstly, annealing influences the geometrical shape generated during the fatigue experiment. Secondly, it affects crack formation and crack growth during fatigue. Influence of temperature on fatigue behavior: an increase in temperature leads to a significant reduction in fatigue strength (from 25 to 100 °C by factor 3). This results from increased dislocation creep at higher temperatures. Microstructural comparison of fracture patterns: The loading amplitude determines the roughness of the fracture surface: Smaller amplitudes lead to a coarser surface structure. This is important to compare accelerated lifetime testing in the lab and modules failures from the field. Simulation of temperature and microstructure dependent fatigue for lifetime prediction: Exemplarily it will be depicted how optimized fatigue behavior in the lab translates into real module lifetime under extreme climate conditions. Despite the actual numbers which show the potential of the approach, but could vary from sample to sample, the focus of the paper is the method itself and its physical background.

Original languageEnglish (US)
Pages (from-to)560-568
Number of pages9
JournalEnergy Procedia
Volume92
DOIs
StatePublished - Aug 1 2016
Externally publishedYes
Event6th International Conference on Crystalline Silicon Photovoltaics, SiliconPV 2016 - Chambery, France
Duration: Mar 7 2016Mar 9 2016

Fingerprint

Solar cells
Fatigue of materials
Annealing
Temperature
Microstructure
Fatigue crack propagation
Crack initiation
Surface structure
Creep
Surface roughness
Testing
Costs
Experiments
Fatigue strength

Keywords

  • extreme climate
  • fatigue
  • interconnector
  • Module Reliability
  • ribbons
  • solar module

ASJC Scopus subject areas

  • Energy(all)

Cite this

Microstructural Optimization Approach of Solar Cell Interconnectors Fatigue Behavior for Enhanced Module Lifetime in Extreme Climates. / MEIER, Rico; Pander, Matthias; Großer, Stephan; Dietrich, Sascha.

In: Energy Procedia, Vol. 92, 01.08.2016, p. 560-568.

Research output: Contribution to journalConference article

@article{e31a25e4bffc40db910a41ad2ab9efb3,
title = "Microstructural Optimization Approach of Solar Cell Interconnectors Fatigue Behavior for Enhanced Module Lifetime in Extreme Climates",
abstract = "Fatigue of the cell interconnectors is one of the main reasons for module failure. Especially with respect to module application in extreme climates new demands on solar cell interconnectors will arise. Optimizations in the manufacturing process to generate a product demand related microstructure are a key to improve the material behavior of interconnectors with respect to extreme climate loading conditions without increasing costs. For achieving this goal several aspects were considered in this paper: Influence of the annealing process on the fatigue behavior: Due to an optimization of the annealing process an increase in ribbon fatigue strength by a factor of four could be achieved. The effect consists of two parts: Firstly, annealing influences the geometrical shape generated during the fatigue experiment. Secondly, it affects crack formation and crack growth during fatigue. Influence of temperature on fatigue behavior: an increase in temperature leads to a significant reduction in fatigue strength (from 25 to 100 °C by factor 3). This results from increased dislocation creep at higher temperatures. Microstructural comparison of fracture patterns: The loading amplitude determines the roughness of the fracture surface: Smaller amplitudes lead to a coarser surface structure. This is important to compare accelerated lifetime testing in the lab and modules failures from the field. Simulation of temperature and microstructure dependent fatigue for lifetime prediction: Exemplarily it will be depicted how optimized fatigue behavior in the lab translates into real module lifetime under extreme climate conditions. Despite the actual numbers which show the potential of the approach, but could vary from sample to sample, the focus of the paper is the method itself and its physical background.",
keywords = "extreme climate, fatigue, interconnector, Module Reliability, ribbons, solar module",
author = "Rico MEIER and Matthias Pander and Stephan Gro{\ss}er and Sascha Dietrich",
year = "2016",
month = "8",
day = "1",
doi = "10.1016/j.egypro.2016.07.020",
language = "English (US)",
volume = "92",
pages = "560--568",
journal = "Energy Procedia",
issn = "1876-6102",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Microstructural Optimization Approach of Solar Cell Interconnectors Fatigue Behavior for Enhanced Module Lifetime in Extreme Climates

AU - MEIER, Rico

AU - Pander, Matthias

AU - Großer, Stephan

AU - Dietrich, Sascha

PY - 2016/8/1

Y1 - 2016/8/1

N2 - Fatigue of the cell interconnectors is one of the main reasons for module failure. Especially with respect to module application in extreme climates new demands on solar cell interconnectors will arise. Optimizations in the manufacturing process to generate a product demand related microstructure are a key to improve the material behavior of interconnectors with respect to extreme climate loading conditions without increasing costs. For achieving this goal several aspects were considered in this paper: Influence of the annealing process on the fatigue behavior: Due to an optimization of the annealing process an increase in ribbon fatigue strength by a factor of four could be achieved. The effect consists of two parts: Firstly, annealing influences the geometrical shape generated during the fatigue experiment. Secondly, it affects crack formation and crack growth during fatigue. Influence of temperature on fatigue behavior: an increase in temperature leads to a significant reduction in fatigue strength (from 25 to 100 °C by factor 3). This results from increased dislocation creep at higher temperatures. Microstructural comparison of fracture patterns: The loading amplitude determines the roughness of the fracture surface: Smaller amplitudes lead to a coarser surface structure. This is important to compare accelerated lifetime testing in the lab and modules failures from the field. Simulation of temperature and microstructure dependent fatigue for lifetime prediction: Exemplarily it will be depicted how optimized fatigue behavior in the lab translates into real module lifetime under extreme climate conditions. Despite the actual numbers which show the potential of the approach, but could vary from sample to sample, the focus of the paper is the method itself and its physical background.

AB - Fatigue of the cell interconnectors is one of the main reasons for module failure. Especially with respect to module application in extreme climates new demands on solar cell interconnectors will arise. Optimizations in the manufacturing process to generate a product demand related microstructure are a key to improve the material behavior of interconnectors with respect to extreme climate loading conditions without increasing costs. For achieving this goal several aspects were considered in this paper: Influence of the annealing process on the fatigue behavior: Due to an optimization of the annealing process an increase in ribbon fatigue strength by a factor of four could be achieved. The effect consists of two parts: Firstly, annealing influences the geometrical shape generated during the fatigue experiment. Secondly, it affects crack formation and crack growth during fatigue. Influence of temperature on fatigue behavior: an increase in temperature leads to a significant reduction in fatigue strength (from 25 to 100 °C by factor 3). This results from increased dislocation creep at higher temperatures. Microstructural comparison of fracture patterns: The loading amplitude determines the roughness of the fracture surface: Smaller amplitudes lead to a coarser surface structure. This is important to compare accelerated lifetime testing in the lab and modules failures from the field. Simulation of temperature and microstructure dependent fatigue for lifetime prediction: Exemplarily it will be depicted how optimized fatigue behavior in the lab translates into real module lifetime under extreme climate conditions. Despite the actual numbers which show the potential of the approach, but could vary from sample to sample, the focus of the paper is the method itself and its physical background.

KW - extreme climate

KW - fatigue

KW - interconnector

KW - Module Reliability

KW - ribbons

KW - solar module

UR - http://www.scopus.com/inward/record.url?scp=85014437829&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85014437829&partnerID=8YFLogxK

U2 - 10.1016/j.egypro.2016.07.020

DO - 10.1016/j.egypro.2016.07.020

M3 - Conference article

AN - SCOPUS:85014437829

VL - 92

SP - 560

EP - 568

JO - Energy Procedia

JF - Energy Procedia

SN - 1876-6102

ER -