TY - JOUR
T1 - Microscale 3D Printing of Nanotwinned Copper
AU - Behroozfar, Ali
AU - Daryadel, Soheil
AU - Morsali, S. Reza
AU - Moreno, Salvador
AU - Baniasadi, Mahmoud
AU - Bernal, Rodrigo A.
AU - Minary-Jolandan, Majid
N1 - Publisher Copyright:
© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinhei/1.
PY - 2018/1/25
Y1 - 2018/1/25
N2 - Nanotwinned (nt)-metals exhibit superior mechanical and electrical properties compared to their coarse-grained and nanograined counterparts. nt-metals in film and bulk forms are obtained using physical and chemical processes including pulsed electrodeposition (PED), plastic deformation, recrystallization, phase transformation, and sputter deposition. However, currently, there is no process for 3D printing (additive manufacturing) of nt-metals. Microscale 3D printing of nt-Cu is demonstrated with high density of coherent twin boundaries using a new room temperature process based on localized PED (L-PED). The 3D printed nt-Cu is fully dense, with low to none impurities, and low microstructural defects, and without obvious interface between printed layers, which overall result in good mechanical and electrical properties, without any postprocessing steps. The L-PED process enables direct 3D printing of layer-by-layer and complex 3D microscale nt-Cu structures, which may find applications for fabrication of metamaterials, sensors, plasmonics, and micro/nanoelectromechanical systems.
AB - Nanotwinned (nt)-metals exhibit superior mechanical and electrical properties compared to their coarse-grained and nanograined counterparts. nt-metals in film and bulk forms are obtained using physical and chemical processes including pulsed electrodeposition (PED), plastic deformation, recrystallization, phase transformation, and sputter deposition. However, currently, there is no process for 3D printing (additive manufacturing) of nt-metals. Microscale 3D printing of nt-Cu is demonstrated with high density of coherent twin boundaries using a new room temperature process based on localized PED (L-PED). The 3D printed nt-Cu is fully dense, with low to none impurities, and low microstructural defects, and without obvious interface between printed layers, which overall result in good mechanical and electrical properties, without any postprocessing steps. The L-PED process enables direct 3D printing of layer-by-layer and complex 3D microscale nt-Cu structures, which may find applications for fabrication of metamaterials, sensors, plasmonics, and micro/nanoelectromechanical systems.
KW - advanced manufacturing
KW - microscale 3D printing
KW - nanotwinned copper (nt-Cu)
KW - pulsed electrodeposition (PED)
KW - twin boundaries (TB)
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U2 - 10.1002/adma.201705107
DO - 10.1002/adma.201705107
M3 - Article
C2 - 29215174
AN - SCOPUS:85038076954
SN - 0935-9648
VL - 30
JO - Advanced Materials
JF - Advanced Materials
IS - 4
M1 - 1705107
ER -