Micromachined probes for submillimeter-wave on-wafer measurements - Part I: Mechanical design and characterization

Theodore J. Reck; Lihan Chen; Chunhu Zhang; Alex Arsenovic; Christopher Groppi; Arthur W. Lichtenberger; Robert M. Weikle; N. Scott Barker

doi:10.1109/TTHZ.2011.2165013

Micromachined probes for submillimeter-wave on-wafer measurements - Part I: Mechanical design and characterization

Theodore J. Reck, Lihan Chen, Chunhu Zhang, Alex Arsenovic, Christopher Groppi, Arthur W. Lichtenberger, Robert M. Weikle, N. Scott Barker

Earth and Space Exploration, School of (SESE)

Research output: Contribution to journal › Article › peer-review

52 Scopus citations

Abstract

The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 μm thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 ω with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.

Original language	English (US)
Article number	6026246
Pages (from-to)	349-356
Number of pages	8
Journal	IEEE Transactions on Terahertz Science and Technology
Volume	1
Issue number	2
DOIs	https://doi.org/10.1109/TTHZ.2011.2165013
State	Published - Nov 2011

Keywords

Coplanar waveguide
micromachining
rectangular waveguide
submillimeter-wave integrated circuits
submillimeter-wave measurements

ASJC Scopus subject areas

Radiation
Electrical and Electronic Engineering

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10.1109/TTHZ.2011.2165013

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title = "Micromachined probes for submillimeter-wave on-wafer measurements - Part I: Mechanical design and characterization",

abstract = "The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 μm thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 ω with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.",

keywords = "Coplanar waveguide, micromachining, rectangular waveguide, submillimeter-wave integrated circuits, submillimeter-wave measurements",

author = "Reck, {Theodore J.} and Lihan Chen and Chunhu Zhang and Alex Arsenovic and Christopher Groppi and Lichtenberger, {Arthur W.} and Weikle, {Robert M.} and Barker, {N. Scott}",

note = "Funding Information: Manuscript received March 02, 2011; revised July 05, 2011; accepted July 07, 2011. Date of publication September 23, 2011; date of current version October 28, 2011. This work was supported by the Defense Advanced Reaserch Project Agency (DARPA) THz Electronics Program and by the Army Research Laboratory under DARPA Contract HR0011-09-C-0062, under a sub-contract from Northrop Grumman and the National Ground Intelligence Center Contract W911W5-06-C-0001, and by a contract from Teledyne Scientific Company, LLC under Contract G0U551521.",

year = "2011",

month = nov,

doi = "10.1109/TTHZ.2011.2165013",

language = "English (US)",

volume = "1",

pages = "349--356",

journal = "IEEE Transactions on Terahertz Science and Technology",

issn = "2156-342X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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T1 - Micromachined probes for submillimeter-wave on-wafer measurements - Part I

T2 - Mechanical design and characterization

AU - Reck, Theodore J.

AU - Chen, Lihan

AU - Zhang, Chunhu

AU - Arsenovic, Alex

AU - Groppi, Christopher

AU - Lichtenberger, Arthur W.

AU - Weikle, Robert M.

AU - Barker, N. Scott

N1 - Funding Information: Manuscript received March 02, 2011; revised July 05, 2011; accepted July 07, 2011. Date of publication September 23, 2011; date of current version October 28, 2011. This work was supported by the Defense Advanced Reaserch Project Agency (DARPA) THz Electronics Program and by the Army Research Laboratory under DARPA Contract HR0011-09-C-0062, under a sub-contract from Northrop Grumman and the National Ground Intelligence Center Contract W911W5-06-C-0001, and by a contract from Teledyne Scientific Company, LLC under Contract G0U551521.

PY - 2011/11

Y1 - 2011/11

N2 - The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 μm thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 ω with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.

AB - The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 μm thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 ω with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.

KW - Coplanar waveguide

KW - micromachining

KW - rectangular waveguide

KW - submillimeter-wave integrated circuits

KW - submillimeter-wave measurements

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Micromachined probes for submillimeter-wave on-wafer measurements - Part I: Mechanical design and characterization

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Keywords

ASJC Scopus subject areas

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