Micromachined probes for submillimeter-wave on-wafer measurements - Part I: Mechanical design and characterization

Theodore J. Reck, Lihan Chen, Chunhu Zhang, Alex Arsenovic, Christopher Groppi, Arthur W. Lichtenberger, Robert M. Weikle, N. Scott Barker

Research output: Contribution to journalArticle

37 Scopus citations


The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 μm thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 ω with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.

Original languageEnglish (US)
Article number6026246
Pages (from-to)349-356
Number of pages8
JournalIEEE Transactions on Terahertz Science and Technology
Issue number2
StatePublished - Nov 1 2011



  • Coplanar waveguide
  • micromachining
  • rectangular waveguide
  • submillimeter-wave integrated circuits
  • submillimeter-wave measurements

ASJC Scopus subject areas

  • Radiation
  • Electrical and Electronic Engineering

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