Micromachined probes for submillimeter-wave on-wafer measurements - Part II: RF design and characterization

Theodore J. Reck; Lihan Chen; Chunhu Zhang; Alex Arsenovic; Christopher Groppi; Arthur Lichtenberger; Robert M. Weikle; N. Scott Barker

doi:10.1109/TTHZ.2011.2165020

Micromachined probes for submillimeter-wave on-wafer measurements - Part II: RF design and characterization

Theodore J. Reck, Lihan Chen, Chunhu Zhang, Alex Arsenovic, Christopher Groppi, Arthur Lichtenberger, Robert M. Weikle, N. Scott Barker

CLAS-NS: Earth and Space Exploration, School of (SESE)

Research output: Contribution to journal › Article › peer-review

51 Scopus citations

Abstract

The electromagnetic design and characterization of a micromachined submillimeter-wave on-wafer probe is presented. The mechanical design and fabrication of the probe is presented in the companion paper (Part I). Finite element simulations are applied to design an integrated probe chip to couple between rectangular waveguide and the ground-signal-ground (GSG) probe. Two designs based on different transmission line topologies are implemented and their performance assessed. The insertion loss of the probes over the WR-1.5 band measures between 6-10 dB and return loss measures from 10 to 15 dB. Offset short measurements are used to verify the performance of the probes and that they can be employed for calibrated on-wafer measurements.

Original language	English (US)
Article number	6026247
Pages (from-to)	357-363
Number of pages	7
Journal	IEEE Transactions on Terahertz Science and Technology
Volume	1
Issue number	2
DOIs	https://doi.org/10.1109/TTHZ.2011.2165020
State	Published - Nov 2011

Keywords

Coplanar waveguides
micromachining
rectangular waveguides
submillimeter-wave integrated circuits
submillimeter-wave measurements

ASJC Scopus subject areas

Radiation
Electrical and Electronic Engineering

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10.1109/TTHZ.2011.2165020

Cite this

Micromachined probes for submillimeter-wave on-wafer measurements - Part II : RF design and characterization. / Reck, Theodore J.; Chen, Lihan; Zhang, Chunhu; Arsenovic, Alex; Groppi, Christopher; Lichtenberger, Arthur; Weikle, Robert M.; Barker, N. Scott.

In: IEEE Transactions on Terahertz Science and Technology, Vol. 1, No. 2, 6026247, 11.2011, p. 357-363.

Research output: Contribution to journal › Article › peer-review

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abstract = "The electromagnetic design and characterization of a micromachined submillimeter-wave on-wafer probe is presented. The mechanical design and fabrication of the probe is presented in the companion paper (Part I). Finite element simulations are applied to design an integrated probe chip to couple between rectangular waveguide and the ground-signal-ground (GSG) probe. Two designs based on different transmission line topologies are implemented and their performance assessed. The insertion loss of the probes over the WR-1.5 band measures between 6-10 dB and return loss measures from 10 to 15 dB. Offset short measurements are used to verify the performance of the probes and that they can be employed for calibrated on-wafer measurements.",

keywords = "Coplanar waveguides, micromachining, rectangular waveguides, submillimeter-wave integrated circuits, submillimeter-wave measurements",

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note = "Funding Information: Manuscript received March 02, 2011; revised July 05, 2011; accepted July 07, 2011. Date of publication September 23, 2011; date of current version October 28, 2011. This work was supported by the Defense Advanced Research Projects Agency (DARPA) THz Electronics Program and by the Army Research Laboratory under DARPA Contract HR0011-09-C-0062 under a sub-contract from Northrop Grumman and the National Ground Intelligence Center under Contract W911W5-06-C-0001 and a contract from Teledyne Scientific Company, LLC under Contract G0U551521.",

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Micromachined probes for submillimeter-wave on-wafer measurements - Part II: RF design and characterization

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Keywords

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