Micromachined probes for submillimeter-wave on-wafer measurements - Part II: RF design and characterization

Theodore J. Reck, Lihan Chen, Chunhu Zhang, Alex Arsenovic, Christopher Groppi, Arthur Lichtenberger, Robert M. Weikle, N. Scott Barker

Research output: Contribution to journalArticlepeer-review

57 Scopus citations


The electromagnetic design and characterization of a micromachined submillimeter-wave on-wafer probe is presented. The mechanical design and fabrication of the probe is presented in the companion paper (Part I). Finite element simulations are applied to design an integrated probe chip to couple between rectangular waveguide and the ground-signal-ground (GSG) probe. Two designs based on different transmission line topologies are implemented and their performance assessed. The insertion loss of the probes over the WR-1.5 band measures between 6-10 dB and return loss measures from 10 to 15 dB. Offset short measurements are used to verify the performance of the probes and that they can be employed for calibrated on-wafer measurements.

Original languageEnglish (US)
Article number6026247
Pages (from-to)357-363
Number of pages7
JournalIEEE Transactions on Terahertz Science and Technology
Issue number2
StatePublished - Nov 2011


  • Coplanar waveguides
  • micromachining
  • rectangular waveguides
  • submillimeter-wave integrated circuits
  • submillimeter-wave measurements

ASJC Scopus subject areas

  • Radiation
  • Electrical and Electronic Engineering


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