Methodology of reliability and power density analysis of SST topologies

Kuan Wang, Qin Lei, Chunhui Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper proposes a reliability analysis model and a power density analysis to evaluate the Solid-State Transformer(SST) topologies for different applications. The solid-state device rating and the redundancy number are considered as two major factors affecting the reliability. In each topology, the optimized selections of these two factors will be determined to reach sufficient reliability. The power density is influenced by the device volume, the transformer volume and the capacitor volume. In terms of these three aspects, the topology which has the highest power density is selected for the certain application. The effectiveness of the model is validated by the comparison between evaluation results and the actual industry products.

Original languageEnglish (US)
Title of host publication2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1851-1856
Number of pages6
ISBN (Electronic)9781509053667
DOIs
StatePublished - May 17 2017
Event32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States
Duration: Mar 26 2017Mar 30 2017

Other

Other32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
CountryUnited States
CityTampa
Period3/26/173/30/17

Fingerprint

Topology
Solid state devices
Reliability analysis
Redundancy
Capacitors
Industry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wang, K., Lei, Q., & Liu, C. (2017). Methodology of reliability and power density analysis of SST topologies. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017 (pp. 1851-1856). [7930950] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2017.7930950

Methodology of reliability and power density analysis of SST topologies. / Wang, Kuan; Lei, Qin; Liu, Chunhui.

2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1851-1856 7930950.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, K, Lei, Q & Liu, C 2017, Methodology of reliability and power density analysis of SST topologies. in 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017., 7930950, Institute of Electrical and Electronics Engineers Inc., pp. 1851-1856, 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017, Tampa, United States, 3/26/17. https://doi.org/10.1109/APEC.2017.7930950
Wang K, Lei Q, Liu C. Methodology of reliability and power density analysis of SST topologies. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1851-1856. 7930950 https://doi.org/10.1109/APEC.2017.7930950
Wang, Kuan ; Lei, Qin ; Liu, Chunhui. / Methodology of reliability and power density analysis of SST topologies. 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1851-1856
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