Methodology for automated design of microelectronic packages

Subramaniam Rajan, V. Sarihan, M. Mahalingam

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A general design methodology for the optimal design of electronic packages is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) software system.

Original languageEnglish (US)
Pages (from-to)274-281
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume116
Issue number4
StatePublished - Dec 1994

Fingerprint

Microelectronics
Nonlinear programming
Packaging
Finite element method
Electronics packaging
Sensitivity analysis
Communication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Methodology for automated design of microelectronic packages. / Rajan, Subramaniam; Sarihan, V.; Mahalingam, M.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 116, No. 4, 12.1994, p. 274-281.

Research output: Contribution to journalArticle

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