Methodology for automated design of electronic components with a case study

Subramaniam Rajan, V. Sarihan, M. Mahalingam

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

A general design methodology for the optimal (packaging) design of electronic components is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) system.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages33-41
Number of pages9
ISBN (Print)0791807665
StatePublished - Dec 1 1992
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: Apr 9 1992Apr 12 1992

Publication series

NameAmerican Society of Mechanical Engineers, EEP
Volume1

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period4/9/924/12/92

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • Cite this

    Rajan, S., Sarihan, V., & Mahalingam, M. (1992). Methodology for automated design of electronic components with a case study. In American Society of Mechanical Engineers, EEP (pp. 33-41). (American Society of Mechanical Engineers, EEP; Vol. 1). Publ by ASME.