Methodology for automated design of electronic components with a case study

Subramaniam Rajan; V. Sarihan; M. Mahalingam

Methodology for automated design of electronic components with a case study

Subramaniam Rajan, V. Sarihan, M. Mahalingam

Civil and Environmental Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

A general design methodology for the optimal (packaging) design of electronic components is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) system.

Original language	English (US)
Title of host publication	American Society of Mechanical Engineers, EEP
Publisher	Publ by ASME
Pages	33-41
Number of pages	9
ISBN (Print)	0791807665
State	Published - Dec 1 1992
Event	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA Duration: Apr 9 1992 → Apr 12 1992

Publication series

Name	American Society of Mechanical Engineers, EEP
Volume	1

Other

Other	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
City	Milpitas, CA, USA
Period	4/9/92 → 4/12/92

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering

Cite this

@inproceedings{ff2867868b51407496263d69a974f70e,

title = "Methodology for automated design of electronic components with a case study",

abstract = "A general design methodology for the optimal (packaging) design of electronic components is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) system.",

author = "Subramaniam Rajan and V. Sarihan and M. Mahalingam",

year = "1992",

month = dec,

day = "1",

language = "English (US)",

isbn = "0791807665",

series = "American Society of Mechanical Engineers, EEP",

publisher = "Publ by ASME",

pages = "33--41",

booktitle = "American Society of Mechanical Engineers, EEP",

note = "Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) ; Conference date: 09-04-1992 Through 12-04-1992",

}

TY - GEN

T1 - Methodology for automated design of electronic components with a case study

AU - Rajan, Subramaniam

AU - Sarihan, V.

AU - Mahalingam, M.

PY - 1992/12/1

Y1 - 1992/12/1

N2 - A general design methodology for the optimal (packaging) design of electronic components is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) system.

AB - A general design methodology for the optimal (packaging) design of electronic components is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) system.

UR - http://www.scopus.com/inward/record.url?scp=0027065384&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027065384&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027065384

SN - 0791807665

T3 - American Society of Mechanical Engineers, EEP

SP - 33

EP - 41

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)

Y2 - 9 April 1992 through 12 April 1992

ER -

Methodology for automated design of electronic components with a case study

Abstract

Publication series

Other

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this