Abstract

Current mainstream memory technologies are unlikely to completely fulfill the solid state data storage requirements that will be imposed beyond the 32 nm node of the International Technology Roadmap for Semiconductors. One potential replacement technology is resistance change memory based on solid electrolytes and a number of significant research and development efforts are already underway. The lowering of the resistance is attained by the reduction of ions in a relatively high resistivity electrolyte to form a conducting bridge between the electrodes. The resistance is returned to the high value via the application of a reverse bias that results in the breaking of the conducting pathway. Germanium chalcogenides and Ag-Ge-S ternaries in particular possess good thermal processing characteristics while maintaining the necessary high ion mobility for rapid switching. Thermally diffused copper in deposited SiO2 also is of interest, as thermal stability in excess of 600°C and commonly used constituents makes this material system compatible with the widest range of back-end-of-line processes. This paper details some of the developments in the understanding of the materials used in solid electrolyte resistance change devices and presents a short review of the electrical characteristics of devices based on Ag-Ge-S and Cu-Si-O electrolytes.

Original languageEnglish (US)
Title of host publication2007 MRS Spring Meeting
Pages165-174
Number of pages10
StatePublished - Dec 1 2007
Event2007 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 9 2007Apr 13 2007

Publication series

NameMaterials Research Society Symposium Proceedings
Volume997
ISSN (Print)0272-9172

Other

Other2007 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period4/9/074/13/07

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ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Kozicki, M. (2007). Memory devices based on solid electrolytes. In 2007 MRS Spring Meeting (pp. 165-174). (Materials Research Society Symposium Proceedings; Vol. 997).