Mechanical strength and failure characterization of Sn-Ag-Cu intermetallic compound joints at the microscale

Engineering & Materials Science

• Intermetallics 98%
• Strength of materials 97%
• Characterization (materials science) 82%
• Energy release rate 36%
• Soldering alloys 30%
• Shear strength 30%
• X rays 28%
• Three dimensional integrated circuits 21%
• Peeling 19%
• Spectroscopy 17%
• Cantilever beams 17%
• Diffraction 16%
• Bending tests 16%
• Microelectronics 16%
• Energy dispersive spectroscopy 16%
• Plasticity 14%
• Fracture toughness 13%
• Creep 13%
• Copper 12%
• Scanning electron microscopy 12%
• Chemical analysis 10%
• Industry 6%

Physics & Astronomy

• microbalances 94%
• intermetallics 83%
• characterization 52%
• shear strength 35%
• solders 34%
• peeling 19%
• cantilever beams 17%
• miniaturization 17%
• x ray spectroscopy 15%
• microelectronics 15%
• fracture strength 15%
• integrated circuits 14%
• plastic properties 14%
• energy 13%
• x ray diffraction 13%
• industries 13%
• copper 11%
• shear 10%
• scanning electron microscopy 10%
• configurations 8%

Chemical Compounds

• Intermetallic Compound 100%
• Strength 59%
• Solder 38%
• Shear Strength 35%
• Cantilever Beam 25%
• Creep 19%
• Plastic Property 18%
• Size Effect 17%
• Fracture Toughness 17%
• Microelectronics 17%
• Energy 14%
• Shear 14%
• Industry 11%
• Spectroscopy 10%
• Chemical Transformation 9%
• Diffusion 9%
• Scanning Electron Microscopy 9%
• Environment 8%
• Composite Material 7%
• Amount 6%