Sn-Ag-Cu lead-free solder have been shown to have inferior mechanical shock resistance to that of Pb-Sn alloy. Sn-rich solders containing rare earth elements have been shown to have superior mechanical properties when compared to conventional Sn-Ag-Cu solder, in terms of strain-to-failure. In this paper, we report on the mechanical shock behavior of Sn-3.9Ag-0.7Cu and Ce-containing Sn-3.9Ag-0.7Cu alloys over the strain rate range of 10-3-12 s -1. Failure mechanisms of solders in different strain regimes are investigated based on the fractography analysis. It will be shown that the shock performance of Sn-3.9Ag-0.7Cu solders can be improved with addition of trace amount of Ce in the solder matrix controlled regime. The role of CeSn 3 intermetallics on the enhanced dynamic performance is discussed.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Safety, Risk, Reliability and Quality
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering