Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints

H. X. Xie, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

23 Scopus citations


Sn-Ag-Cu lead-free solder have been shown to have inferior mechanical shock resistance to that of Pb-Sn alloy. Sn-rich solders containing rare earth elements have been shown to have superior mechanical properties when compared to conventional Sn-Ag-Cu solder, in terms of strain-to-failure. In this paper, we report on the mechanical shock behavior of Sn-3.9Ag-0.7Cu and Ce-containing Sn-3.9Ag-0.7Cu alloys over the strain rate range of 10-3-12 s -1. Failure mechanisms of solders in different strain regimes are investigated based on the fractography analysis. It will be shown that the shock performance of Sn-3.9Ag-0.7Cu solders can be improved with addition of trace amount of Ce in the solder matrix controlled regime. The role of CeSn 3 intermetallics on the enhanced dynamic performance is discussed.

Original languageEnglish (US)
Pages (from-to)733-740
Number of pages8
JournalMicroelectronics Reliability
Issue number5
StatePublished - May 2013

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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