Fingerprint
Dive into the research topics of 'Mechanical shock behavior of bulk pure Sn solder'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Mechanical shock behavior of bulk pure Sn solder
K. E. Yazzie, H. Fei, J. J. Williams, Hanqing Jiang, Nikhilesh Chawla
- Flexible Electronics and Display Center (FEDC)
- Mechanical and Aerospace Engineering
- Adaptive Intelligent Materials and Systems Center (AIMS)
- Engineering of Matter, Transport and Energy, School for (IAFSE-SEMTE)
- Materials Science and Engineering
- Chemical Engineering
- Engineering, Ira A. Fulton Schools of (IAFSE)
Research output: Contribution to journal › Article › peer-review
7
Scopus
citations